Denmark consumer electronics product company Bang & Olufsen plans
with the world's largest television producer and a leading OLED and
network operating system technology company LG signed a strategic
technology partnership agreement.
According to the agreement, Olufsen & Bang will focus on the
development of its combination with the television design, acoustics and
smart home core competitiveness, and with the LG in the OLED aspects of
the professional and technical combination.
Bang & Olufsen CEO Mantoni Tue said: the partnership with LG will
promote the Bang & Olufsen to go to the forefront of innovation in
the TV type. TV variety is currently undergoing major changes, the Bang
& Olufsen is also very important. This partnership will help Olufsen
& Bang to respond to the challenges associated with scale and
complexity."
As Bang & Olufsen will achieve the required technical
capabilities and scale of the long-term profitability of the company,
the establishment of a partnership will help to resolve a major
strategic challenge. This cooperation has prompted Bang & Olufsen to
focus on the core competencies of acoustics and design, and further
optimize the company's supply chain, development, production and
service.
In partnership with Bang Olufsen & LG production of the first
OLED TV is expected to launch in 2017. Partnership also includes
licensing and product bundling activities, and other aspects of
cooperation.
After establishing partnership, Olufsen & Bang is expected to
increase gross profit and reduce the cost of production capacity. After
the signing of the agreement, the next three years to save 1500-2000
million Danish crown.
In addition, Bang & Olufsen is also expected to achieve
restructuring costs 1000-1500 million Danish crown, of which the 5
million Danish crown will be achieved in the fourth quarter of 2016.
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Monday, March 28, 2016
Tuesday, March 22, 2016
7Nm process will become the main battlefield of Intel electric pressure
Security plan (ARM) and Taiwan TSMC announced a multi-year agreement
and cooperation for 7 nm FinFET process technology, including support of
future of low power consumption, high efficiency can operation
system-on-a-chip (SOC) design solutions. This agreement is a
continuation of the previous Artisan ARM based entity IP 16 nm and 10 nm
FinFET cooperation.
In fact, TSMC currently advanced production process process, belong to the same generation of 10 nm, 7 nm process has to catch up, even beyond the competitors Intel (Intel).
Taiwan semiconductor electric advanced process of 10 nm, 7 nm, 5 nm, and other parts, all processes are all on schedule10 nanometer process to the first quarter of 2016 finished product certification, and 10 nm / nanotechnology applications is very extensive, such as mobile phones, higher-order networking, gaming, wearable and, with the rapid transmission efficiency and low power consumption, and 7 nm is expected to 2018 Season 1 to start mass production.
It is understood, Intel estimates in 2018 to determine production 10 nm and 7 nm estimated to 2019, and Samsung Electronics (Samsung Electronics) at 10 nm progress is uncertain, TSMC in 10 / 7 nanometer generation has displayed its ambition, and launched a multi client layout.
Part of the downstream industry, said may not be using 10 nanometer products, such as 20 nm to 16 nm process transition products, but 7 nm is locked for the next generation the main goal of the, and the Taiwan product long-term contracts and arm concluded also established 7 nm in the future will become the main battlefield of International manufacturers.
According to TSMC in previous corporate open that argument, 7 nm process can be provided in the 2018 Season 1, and in accordance with the Taiwan semiconductor electrical plans, 5 nm will be launched in 2 years after 7 nm process, in about 2020 half visible clue.
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In fact, TSMC currently advanced production process process, belong to the same generation of 10 nm, 7 nm process has to catch up, even beyond the competitors Intel (Intel).
Taiwan semiconductor electric advanced process of 10 nm, 7 nm, 5 nm, and other parts, all processes are all on schedule10 nanometer process to the first quarter of 2016 finished product certification, and 10 nm / nanotechnology applications is very extensive, such as mobile phones, higher-order networking, gaming, wearable and, with the rapid transmission efficiency and low power consumption, and 7 nm is expected to 2018 Season 1 to start mass production.
It is understood, Intel estimates in 2018 to determine production 10 nm and 7 nm estimated to 2019, and Samsung Electronics (Samsung Electronics) at 10 nm progress is uncertain, TSMC in 10 / 7 nanometer generation has displayed its ambition, and launched a multi client layout.
Part of the downstream industry, said may not be using 10 nanometer products, such as 20 nm to 16 nm process transition products, but 7 nm is locked for the next generation the main goal of the, and the Taiwan product long-term contracts and arm concluded also established 7 nm in the future will become the main battlefield of International manufacturers.
According to TSMC in previous corporate open that argument, 7 nm process can be provided in the 2018 Season 1, and in accordance with the Taiwan semiconductor electrical plans, 5 nm will be launched in 2 years after 7 nm process, in about 2020 half visible clue.
Finding electronic components, lincomponents.com is a specialized obsolete and hard to find electronic components of the site, in the above can be found more than 30 million pieces of components types, such as: n6s25t0c102 and 4nf20l, want to know more, please visit our website http://www.lincomponents.com.
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