Friday, December 30, 2016

Apple has not admitted iPhone6s battery problem

According to foreign media reports, if you are using the iPhone 6 or iPhone 6s, you may encounter battery problems. The most common situation is that even if the phone shows the battery still has enough power, but the iPhone6 ​​or iPhone 6s may still automatically shut down automatically.
Moreover, this is not a new problem, because the first time earlier this year, users have raised this issue. According to the "Forbes" reported that Apple official forums related information posted, a complaint about non-iPhone 6s models have TV problems post has more than 62 pages of replies, many of which users are said to be upgrading iOS10.2 After the problem, the problem is more obvious after the update, has seriously affected the normal use of the user. ff300r17ke3
Apple officials also launched a limited range of battery replacement items for the iPhone 6s and announced that the software upgrade will help other iPhone models to solve the battery problem. However, from the current situation, the effect of software upgrades seems very limited.
In this regard, "Fortune" magazine editor Jeff - John - Roberts (Jeff John Roberts) that the most annoying thing about this is that Apple refused to clarify where the problem in the end. Moreover, the company has been "pretending" other models do not exist similar problems, but only for some iPhone6s models start a limited range of battery replacement project.
It is reported that Roberts had their own iPhone 6 battery problems encountered, and "Fortune" magazine at least five employees of the iPhone 6 also encountered a similar problem. Roberts revealed that he learned that Apple retail store employees will provide users with an unusual solution, that Apple can re-install the firmware to the iPhone 6 in question, but this method may lead to the loss of important data, including short message content . cm1000ha-24h
Apple officially issued a formal statement to the Fortune magazine, although Apple in the statement written in a lot of text, but always evasive does not directly recognize the safety of its equipment battery, Apple's statement reads as follows:
We always work hard and are committed to providing the best products, user experience and customer support. We believe that this is the Apple user satisfaction in China and the world smartphone manufacturers have been the leading reason.
We have been very serious about customer complaints, including a limited number of iPhone abnormal shutdown. We also need to thank the media for conveying this issue to us. In the face of these problems, we will launch a formal investigation, and will carry out a detailed analysis of the involved equipment. When we find the problem, Apple will provide users with possible solutions.
Company survey found that in September 2015 and October during the production of a small amount of iPhone 6s used in the manufacturing process with too much outside air mixed with the battery parts. Two weeks ago, we launched a free replacement project for affected batteries around the world. Once again, we apologize for the inconvenience this has caused to users, but it must be noted that this is not a security issue.
At the same time, there are a small number of models not affected by the list of users also reflect their own equipment there is the problem of automatic shutdown, it is because some models will be in normal use for the purpose of protecting the device circuit components automatically shut down. To gather more information on this issue, we will have an additional diagnostic feature built into the iOS software update expected next week. By collecting this information, we can improve the algorithm used to manage battery performance and shutdown. And if this improvement proved to be feasible, we will be added to the future of the software update push.

Monday, December 12, 2016

KIT researches multi-core processors for automotive and industrial applications

Safety-critical applications in automotive, aviation and industry 4.0 will require a significant increase in digital computing performance. This can be provided via Multicore technologies. The ARAMiS II project, developed at the KIT, aims to increase safety, efficiency and comfort by using multicore technologies in vehicles, aircraft and production facilities.
The demand for digital computing performance is increasing enormously, among other things by highly automated vehicles and real-time networked machines, but also by the increasing integration and interaction with other products and services. The use of Multicore technologies significantly increases the computing power of embedded systems in vehicles, aircraft or industrial plants. Multicore processors have multiple processor cores that must work in parallel. This can increase the computing power enormously, but the development is more complex for several processor cores - for example, when it comes to timing or critical point critical requirements. 7101j52zqe22
Multicore processors are now used successfully in many applications, such as PCs, tablets and smartphones. However, safety-critical applications in mobility and industry require additional complex requirements, which is why multi-core systems have hardly become established in industrial embedded applications or in the automotive industry. The requirements for strict safety certifications have so far hardly been met by these building blocks .
"In the new ARAMiS II project, we are creating the indispensable methodological prerequisites to increase safety, efficiency and comfort in the use of multicore technologies and make them industrially available. The results of ARAMiS II are supplemented by standardization activities of the domains concerned and are thus made available to other industry partners. "Says Professor Jürgen Becker, spokesman of the institute management of the Institute for Information Technology (ITIV) of the KIT and together with Falco Bapp of the ITIV coordinator of ARAMiS II. 7201k2zge
In its predecessor, the ARAMiS project, KIT has successfully demonstrated with numerous partners from research and industry that multicore technologies can be used and integrated in safety-critical applications. Based on this, ARAMiS II is to develop, develop and optimize the efficient development processes, especially the systematic tool chain and the industrial platforms with the necessary methods, for the reliable use of multicore architectures. Demonstrators in the domains of automotive engineering, aerospace and industrial automation should demonstrate the applicability of the developed concepts and methods across all domains.
In a kick-off meeting on 1 and 2 December 2016, all partners identified the next activities in the six subprojects: applications and requirements, structured multicore development, multicore methods and tools, multicore platforms, and architectural patterns , Implementation and evaluation, results assurance and utilization.
The consortium of ARAMiS II consists of 33 partners. In addition to renowned research facilities, leading manufacturers from the automotive and aerospace industries as well as the industrial sector as well as various suppliers, software and tool manufacturers are participating. Continental, for example, is an industry spokesman in ARAMiS II, Audi, Bosch, Airbus and Siemens.
Like its predecessor, ARAMiS II has been designed for three years; The project volume totals more than 26 million euros. ARAMiS II is funded by the Federal Ministry of Education and Research (BMBF) with around 15 million euros.

Wednesday, November 16, 2016

Chip industry turnover of over 240 billion US dollars within two years

After a series of mergers and acquisitions, the chip industry, traders have to take a break, and the market for them to choose high-quality transactions are not many.
In the past two years, semiconductor companies have completed more than $ 240 billion in mergers and acquisitions, according to Dealogic, a financial data provider. So far this year, the semiconductor industry M & A transaction size of 130.2 billion US dollars, setting a new record, higher than last year's record 16% higher. Large transactions led to the overall transaction volume, but this is not a small transaction. Over the past two years, six deals have exceeded $ 10 billion and three have exceeded $ 30 billion.
Why is the M & A deal in the chip industry slowing? The reason is simple: there are not many high-quality chip companies available in the market, and most of the companies that want to buy have completed their own deals. Qualcomm took out most of its $ 30 billion in cash reserves to fund the acquisition of NXP Semiconductors. Broadcom has completed a $ 37 billion merger with Avago Technologies earlier this year and has invested another $ 5.5 billion to acquire the network equipment company Brocade Communications Systems. According to financial information provider FactSet, Intel spent more than $ 15 billion last year on acquiring Altera, and then acquired or planned to acquire 12 smaller companies. 50yxf100mce8x11.5
This year's chip industry mergers and acquisitions scale set a new record
Regulatory opposition is another factor restricting chip industry M & A transactions, at least in the chip manufacturing equipment segment of the field is the case. Wafer-equipment makers Lam Research and KLA-Tencor canceled a $ 10.6 billion merger last month after a rigorous review by the US Department of Justice. Applied Materials last year to try to $ 29 billion merger with Tokyo Electronics, but also by the United States Department of Justice of the opposition. Regulatory objections may discourage other chip companies from pursuing larger-scale deals.
Price is also an obstacle, the performance of chip stocks far better than other technology industry stocks. So far this year, the Philadelphia Semiconductor Index has risen more than 25%, while the Nasdaq Composite Index rose only 4%. Nvidia and AMD are often rumored to buy, with the growth rate of growth this year, the two companies' share price has more than doubled. 6437288-2
But chip companies will continue to look for ways to drive growth in low interest rates. Technology companies will be more interested in the automotive field, which acquired from Qualcomm NXP, Samsung 8 billion US dollars acquisition of Harman International can be seen.
A handful of chip companies are not involved in the recent takeover binge. Over the past two years, Nvidia has only acquired a small company, currently sitting on about 3.7 billion US dollars in net cash. Texas Instruments is currently the fourth-largest chip company, since 2011 to $ 6.5 billion acquisition of National Semiconductor, Texas Instruments has never had a deal.
However, these companies will also carefully selected acquisition targets. Texas Instruments CFO in September this year, said at the Investment Conference, the company mainly in the autonomous areas in the next four to five years to bring value-added transactions. In the recent acquisition of frequent transactions, the choice of Texas Instruments less and less.

Sunday, October 30, 2016

Three-layer electrode structure design to improve the energy density of lithium batteries 30%

Yang Yuan, an assistant professor at Columbia University's School of Materials Science and Engineering, has developed a new approach to increasing the energy density of lithium-ion batteries. His three-layer structure of electrodes in the bare air environment to maintain stability, thus making the battery more durable, further reduce the manufacturing cost. The study can increase the energy density of lithium batteries 10-30%, related papers published in early October in the "Nano Letters" periodicals.
Graphite / PMMA / Li three-layer electrode in a battery electrolyte for 24 hours before (left) and after (right). Prior to immersion in the electrolyte, the three-layer electrode is stable in air. After soaking, lithium and graphite reaction, the color turns yellow. Source: Columbia University
"When lithium batteries are charged for the first time, they lose as much as 5-20% of their energy in the first cycle," Yang said. "We have been able to avoid this loss through structural improvements. The approach has great potential for increasing battery life and is expected to be used in portable electronic devices and electric vehicles. " gmf32024abtw
During the first charge after production, a portion of the electrolyte in the lithium battery will change from a liquid state to a solid state due to a reduction reaction and adhere to the negative electrode of the battery. This process is irreversible and reduces the stored energy of the battery.
In the current electrode manufacturing technology, this process to bring the loss of about 10%, but for high-capacity next-generation anode material, such as silicon, the loss will reach 20-30%, which will greatly reduce the battery Of the actual available capacity.
In order to compensate for such initial loss, the conventional method is to add some lithium-rich material to the electrode. However, since most of these materials are unstable in the air environment, they must be manufactured in dry air, which is completely free from moisture, and therefore, the manufacturing cost of the battery is greatly increased.
Yang Yuan developed the three-electrode structure is to ensure that the electrode can be completed in the ordinary air environment to complete the manufacturing.
First of all, he used a layer of "PMMA" (that is, common plexiglass material), to isolate the lithium and air and moisture contact; PMMA polymer and then add a layer of artificial graphite or silicon nanoparticles and other active materials; He allows the PMMA polymer layer to dissolve in the cell electrolyte, thereby conducting lithium and the electrode material. msp430f436ipzr
"This allows us to avoid the air contact between unstable lithium and lithiated electrodes, which can be done in normal air environments and make it easier to produce battery electrodes," Yang explained.
Three-layer structure of the electrode production process: PMMA in the initial state to ensure that lithium does not react with the moisture in the air. When PMMA is dissolved by the battery electrolyte, the graphite contacts with the lithium to compensate for the initial loss due to the reduction of the electrolyte. Source: Columbia University
Yang's method reduced the loss of the existing graphite electrode from 8% to 0.3% and the loss of the silicon electrode from -13% to -15% (negative indicates that the capacity of the battery was taught as the initial state due to the addition of the new lithium material There is an increase). The excess lithium can compensate for the loss of capacity in the subsequent cycle, and thus the cycle life of the battery can be further enhanced.
Li-ion battery energy density (or capacity) in the past 25 years has maintained an annual growth rate of 5-7%, and Yang Yuan research to further improve the growth rate provides a feasibility program. His team is now working to reduce the thickness of PMMA coating in order to reduce its proportion in lithium batteries lower, and strive to achieve industrial production.
"The three-layer electrode design is cleverly designed to produce lithium metal-containing electrodes under normal air conditions," said Yale Wang, assistant professor of chemistry at Yale University. "The initial coulombic efficiency of the electrode has been a major challenge for the lithium-ion battery industry, This simple and effective compensation technology will cause great interest.

Monday, October 10, 2016

Intel OEM Spreadtrum 14nm chip sample this month

Intel has the world's most advanced semiconductor technology in the FinFET process than other manufacturers more than two years in advance of production, 14nm FinFET process although the dystocia, but still than TSMC, Samsung earlier, and Intel's process is the best , The gate distance is the real 14nm level, the other two are water. From the beginning of the transition began in the first half, Intel foundry as a breakthrough point, to win over LG Electronics, and now a customer confirmed that China's Spreadtrum will also use Intel 14nm process foundry, the fastest chip-related October You can sample.
Intel has no doubt in the wafer manufacturing strength, there have been sporadic OEM cooperation, but not many customers, mainly FPGA companies such as Altera, the results of Intel's own customers to the acquisition. Spreadtrum for Intel is not an outsider - Spreadtrum and another company Rui Dike were purple company acquired, and later set up a Unisplendour Company, and Intel Corporation to spend $ 1.5 billion stake in exhibition Rui, accounting for 20% of shares, That is, Intel is now a major shareholder of Spreadtrum. VKI50-12P1
Intel spent so much money to buy shares will naturally not be no good, in addition to planning the Chinese market, it is estimated that OEM cooperation is one of the contents of the negotiations before. Spreadtrum's CEO Li Liyou last year, said on 2016 will use Intel 14nm process foundry chip, there are media broke the news that Intel's 14nm process based on the chip can be the fastest in October to sample, progress is still very fast.
The news pointed out that Spreadtrum's 14nm chip will attract Samsung's orders, is expected to related Samsung mid-range phone will come out in 2017. Samsung has long been the company's VIP customers, although we rarely see based on the Spreadtrum chip (but also a lot of Spreadtrum baseband) smart phone, but in the 3G chip and overseas markets, Samsung Indeed there are many mobile phone is the use of Spreadtrum chip.
According to statistics in June of this year, Spreadtrum + Reddy in the global mobile phone chip market share reached 25.4%, more than MediaTek 24.7%.
On the other hand, cooperation with Intel does not mean that Spreadtrum to give up TSMC, they will still use the latter's 16nm and 28nm process, which is the first use of TSMC SC9860 16nm FFC process mobile phone chips, competitors MediaTek P20, The end of this year will be able to market.
Spreadtrum's accession to the Intel OEM business is a good start, after Intel announced the expansion of foundry business, we know that a customer is LG Electronics, in the 14nm and the future 10nm process OEM, LG will be Intel OEM business, an important partner, but LG ARM chip from the research for a long time, has not broken any movement, far worse than the Samsung Exynos processor. PM15CSJ060
According to the original text, Intel now has about 2,000 employees in China, South Korea, Japan and other Asian customers in Shanghai, there is a team dedicated to serving Chinese customers.

Thursday, September 22, 2016

LED industry will enter a chip packaging and integration route

LED is a kind of electrical energy into light capable of semiconductor electronic components. Such electronic components appear as early as 1962, can only be issued early low-light red, followed by the development of other versions of monochromatic light, the light energy emitted today throughout visible light, infrared and ultraviolet light, luminosity also increased to a considerable luminosity. The use is also made at first as indicator, display panels; With the continuous advancement of technology, light-emitting diodes have been widely used in monitors, televisions and lighting decorative lighting.
    
2010-2016 LED penetration in the market will have a substantial increase, in which the home market rose from 6% to 49%, outdoor lighting increased from 5-40%, while the largest commercial lighting will appear development, rising from 2-51%. With lower LED costs, prices fall, and the policy out of incandescent light, China LED market is growing rapidly, LED lighting penetration gradually increase in 2015 has reached 32%, has become a mainstream source. LED output value of 154 billion yuan from 2011 to 2015, an increase of 396.7 billion yuan, CAGR of 26.69%. lm2594
    
2016 - 2021 China is the development of LED industry analysis and investment potential study shows that the rapid development of China's LED industry is increasingly competitive. Benefit ratio of domestic chip to enhance access to technology as well flip a mature power efficient high-power LED chips, 2011-2015 upstream LED chip industry output value increased year by year, CAGR of 21.32%. 2015 China LED chip industry output value reached 13 billion yuan, an increase of 8.3% slowdown. Midstream LED packaging industry also developed rapidly. 2011-2015 CAGR of 19.01%. The rapid development of China's domestic packaging companies also intensified global competition, China LED packaging industry has entered a period out of competition.
    
LED artificial intelligence replace the equipment, increase production efficiency, reduce production costs. LED as a typical labor-intensive industries, the upstream, midstream and downstream equipment to replace artificial intelligence, LED is expected to increase production efficiency, reduce production costs, and thus LED intelligent equipment has a huge market space. In LED upstream industry, for photovoltaic involving LED chips Prober. LED chip LED Prober for sorting measurement point links. The accuracy and stability of the test device has a very high demand, mainly Taiwan Whitby, MPI ASM and Hong Kong and other major manufacturers, except for Optoelectronic outside yet there are other domestic enterprises involved. Localization services for photovoltaic has advantages, point measuring machines have been mass production, and by the international manufacturers of quality certification. On the midstream industry, LED spectral taping equipment is part of the LED package of essential tool for LED light products, color, electrical, appearance one by one to detect, classify, and taping receipts, to ensure consistency of the three sex. For photovoltaic technology has a profound accumulation in packaging automation, packaging factory to China positive transformation from labor-intensive to capital-intensive, in line with industry trends to create 4.0 smart factory has promoted. hd74ls00p
    
Quality LED industry core technology and high-end products are generally held in foreign hands, but with the rapid development of China's LED business, our core technology and core patents in foreign manufacturers have quietly changed hands this pattern. Upstream has taken shape throughout the next period of time lead to new competition big changes? Chinese and foreign market background is different, the development of chip and packaging industry in Europe and America and Japan and South Korea is different, whether it is research and development, technology infrastructure, industry or stage of development, the future have the opportunity to take the package and chip integration route.

Monday, September 12, 2016

TSMC 10nm production by the end of Apple's customer lock MediaTek Qualcomm Hass

TSMC 10nm by the end of mass production, according to the equipment industry sources, including sea, MediaTek, Qualcomm, Apple and other four major customers, is expected end of this year is expected to complete chip design decision (tape-out), and have started booking TSMC 10nm production next year. TSMC, the first quarter of next year 10 nanometers can contribute revenue in the 10 nanometer production capacity quickly pulled a quarterly basis, the revenue growth momentum strong operating performance this year will be significantly better.
    
In addition, TSMC 7 nanometers estimated to be completed by the first half of next year chip design finalized, the first quarter of 2018, mass production, which currently includes programmable logic gate array (FPGA) maker Xilinx (Xilinx), graphics chip maker Huida (NVIDIA) two 16 nanometer customers have been identified across the 10 nanometer process generation directly with TSMC 7 nm to cooperate. 20t201da2
    
TSMC in the 12-inch wafer Fab 15 Section 5 has completed the first 10 nanometer capacity building, the recent trial production was better than expected, the first 10-nanometer chip has reached a satisfactory yield, there will be three 10-nanometer chips have been complete the design finalized by the end of the wafer and now there will be more to complete the design finalized, the first quarter of next year is expected to start contributing revenue. TSMC continued expansion section 6 and section 7, in addition to support for future 10-nanometer production, but also in some capacity in 2018 will be converted into 7 nanometers enter mass production.
It is understood that TSMC 10 nanometer customers, Continental Huawei Hass Group's semiconductor operation most active Hass phone network processor chip and has been determined to be the TSMC 10 nm process mass production, the fastest at the end of this year will enter volume production. MediaTek mobile phone chip maker also plans to speed up the miniature 10 nanometer, next year the launch of Helio X30 will use TSMC 10 nm production, the fastest in the first quarter next year may begin to expand the cast sheet. u83133169
Qualcomm next-generation 10 nanometer chip Snapdragon 830 phone still commissioned by Samsung OEM, but Qualcomm branched out into the ARM architecture server high-performance computing (HPC) chip market's first 10 nanometer processors, but not to the Samsung production, but TSMC by the steering committee, the same is expected to be finalized before the end to complete the design and mass production.
    
Moreover, this year, Apple TSMC 16-nanometer production A10 Fusion applications processor, has 14 production volume in the park TSMC 12-inch wafer Fab, next generation applications processor A11 is almost exclusively determined by the generation of TSMC continues to win work orders, A11 is expected to be completed by the end of October the design finalized, the second quarter of next year begin commissioned by the TSMC 10-nanometer process chip foundry cast, and will continue to use TSMC's second-generation integrated fan-out wafer level package (InFO WLP) technology.

Thursday, September 1, 2016

2020 global smart solar PV market CAGR of 15.22%

According to Sandler Research released by the global solar PV market intelligence report 2016-2020 shows that one of the key market trends reflected in the growth in demand for services and solutions is growing, mainly due to advances in technology and components, such as smart meters, solar simulation , a smart grid components, services, and smart solar photovoltaic applications.
Most vendors focus on providing a complete solution for intelligent solar energy, ranging from components to the service.
In 2016-- During 2020, Sandler Research expects the global PV market intelligence CAGR growth rate of 15.22%.
According to this report, the increasingly serious environmental problems will be the main driver of market growth. If the global smart energy technologies (including smart solar energy), the global carbon dioxide emissions can be reduced by 15%.
According to geographical area, throughout the Americas region over the forecast period will dominate the smart energy market by 2020, will account for 40% of the total market.
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Wednesday, August 24, 2016

This year a number of agencies downgraded semiconductor output forecast

Average selling prices fell due to the impact, including Gartner (Gartner), and other research institutions have lowered the tone semiconductor output forecast this year, more than previously estimated by the single-digit percentage growth, the recession reduced to single-digit percentage point level.
    
According to the International Semiconductor Industry Association (SEMI) stated that Gartner had forecast this year, the semiconductor industry's output will grow by 1.9%; the World Semiconductor Trade Statistics (WSTS) forecast also the semiconductor industry's output will grow 1.4%.
    
Cowen LRA estimates, the semiconductor output will grow 4.9%; IC Insights estimates, semiconductor output will grow 4%. SEMI said various research coordinating body more than the original estimate, semiconductor output will grow low-single-digit percentage point level.
    
According to WSTS statistics merely the first half of semiconductor output reduction of 6% over last year; SEMI statistics, the amount of semiconductor equipment shipments in the first half decreased by 3% over last year.
    
In addition, the first half of the silicon wafer area shipments are also down 2 percent from a year earlier.
    
Including Gartner and other research institutions have lowered the tone this year, semiconductor output estimates, and more positive growth from the original, into a single-digit percentage decline, falling product prices are the main cause of the recession affect output; that is expected to Gartner, semiconductor output will be reduced by 3%; WSTS also predicts that semiconductor output will be reduced by 2.3%.
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Wednesday, August 17, 2016

Diodes Release enables asynchronous communication Octal Transceiver

Diodes has introduced enables asynchronous communication between data bus 74LVT245BB Octal transceiver control pin determines the direction of data flow, and disable tri-state output, allows completely isolated from the general line. Conventional data bus is mainly used for computer applications, and now televisions, set-top boxes, base stations and a variety of other data communication devices are widely used to provide a broad market for a variety of transceiver circuits.
74LVT245BB device is normal asynchronous communication between data bus provides a partial power-down function, thereby disabling the output current backflow and prevent damage when the device is powered down. The device also adopted during power remain tri-stated output to withstand hot insertion. Schmitt trigger input also includes a bus hold function, and therefore do not need to input resistor unused. Combined with better than 500mA latch immunity, these transceivers can contribute to the achievement of a wide range of design, can be hot-swappable application server computer and cellular telephone base stations without having to switch off the device.
74LVT245BB device specified in the 2.7V to 3.6V operating supply voltage range, can drive 3.3V or 5V input, allowing mixed logic voltage applications. The output can absorb 64mA or 32mA current offer and have <125μA leakage current when forced to reach 5.5V. 74LVT245BB device propagation time is 2.7ns (typical), has a driving capability for large bus architecture, and power-down feature to avoid loading the data bus, bringing advantages in power performance ratio, reliability and cost.
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Thursday, August 11, 2016

Intel's acquisition of Nervana Systems develop artificial intelligence technology

According to the "Wall Street Journal" online edition reported, artificial intelligence technology industry has become a popular trend. In this trend, driven by technology companies are competing to acquire start-up companies in the field of artificial intelligence, Intel became the latest to join the ranks of the acquisition of the company.
Intel on Tuesday announced that it will acquire artificial intelligence start-up companies Nervana Systems, to develop called "deep learning" popular artificial intelligence techniques. Nervana is a company with 48 employees engaged in the semiconductor, software and service development.
Intel did not disclose the purchase price.
Prior to this, Apple on Friday the acquisition of artificial intelligence company Turi Inc. Venture capital research firm CB Insights data show that since 2011, the company acquired a large number of transactions artificial intelligence start-up companies reached 31 pen, these big companies, including Google, Twitter, Yahoo, IBM and Salesforce.com.
PwC calculations included smaller-scale acquisitions, so far this year with AI-related start-up companies has reached 29 pen acquisitions this year, the total transaction volume is expected to exceed last year announced 37 pen.
After the 2010 acquisition of startup Siri, Apple promoted the rapid development of artificial intelligence in the consumer sector. After the acquisition of Turi, Apple is expected to benefit from Turi CEO Carlos Gus Sterling (Carlos Guestrin) expertise, which is the University of Washington professor of machine learning.
"Artificial intelligence will gradually change every industry," a pioneer in the field of deep learning, Baidu's chief scientist and Stanford University associate professor Andrew Ng expressed. He believes that the acquisition of buyer demand for talent to more than technology.
Intel's acquisition of the company's artificial intelligence has a special motivation. Although Xeon chip can handle most computing tasks in the data center, but rival Nvidia GPU faster handling specialized tasks associated with deep learning.
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Thursday, August 4, 2016

IBM introduced DeepFlash 150 all-flash array

IBM recently extended its full line of flash memory products, has launched a new all-flash array --IBM DeepFlash 150. The product is intended to be a cost-effective manner and to control the big data, especially unstructured data. As a result, IBM is currently available, covering almost all of the workload of the flash memory product portfolio.
IBM storage systems and file person in charge with the object storage product manager Alex Chen said the new IBM DeepFlash 15 planned sale in the near future, aimed not find the desired functions on a standard all-flash storage solutions for application type. But most of all-flash arrays tend to focus on more traditional applications, such as virtual desktop infrastructure, block storage, and online transaction processing.
IBM DeepFlash 150 can handle large data sets. IBM claims that its new array density per rack or a single rack unit 170TB capacity flash memory capacity 7PB. High-density flash level so that DeepFlash 150 is also ideal for financial services, healthcare, e-commerce, telecommunications, entertainment and media, and cloud service providers. In addition to its high capacity and performance than flash memory, DeepFlash 150 is also very cost effective per GB capacity of not more than $ 1. IBM recommends that customers use their combined DeepFlash 150 IBM Spectrum Scale, in order to provide key functions covered storage services and big data workloads optimized.
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Thursday, July 28, 2016

ON Semiconductor Introduces Automotive Power Integration Module program

Promote energy efficiency and innovative Semiconductor (ON Semiconductor), further expansion of automotive power integrated module (PIM) product line, launched STK984-190-E. The module is optimized for driving three-phase brushless DC motor (BLDC) for modern automotive applications, comprising six 40 V, 30 A MOSFET configured as a three-phase bridge, and an additional 40 V, 30 A high-side reverse battery protection MOSFET. The MOSFET is mounted onto a direct bond copper (DBC) substrate, resulting in a compact module with excellent heat dissipation, it is only as effective as discrete programs half the board space.
The module is suitable for 12 V automotive motor drive applications, rated power of 300 W, electric pumps, fans and windshield wipers. Using motor controller designers to incorporate such LV8907UW, can create energy efficient BLDC solution with best-in thermal performance and built-in diagnostics, and ultra-small PCB, saving critical dimensions and weight.
Use this module can significantly reduce component count and BOM cost. DBC substrate thermal resistance reduced, thereby reducing the operating temperature of the MOSFET. By reducing the thermal cycling during temperature changes, which reduces the power consumption and increase reliability. Insulation provided by the DBC substrate also enhance the reliability. STK984-190-E specified operating temperature range of -40 ° C to 150 ° C. All integrated MOSFET through AEC-Q101 certification.
Chris Chey, general manager of ON Semiconductor System Solutions Division, said:. "Develop an efficient BLDC drive program usually takes at least 13-15 discrete components, while less than half the number of car components STK984-190-E power modules required in addition to a compact size, STK984-190-E support robust thermal performance with a smaller heat sink. this enables the size and weight of the system is significantly reduced, which means engineers can fully address the challenges currently facing with regard to improve fuel economy and overcoming space constraints. "
STK984-190-E lead-free DIP-S3 package measuring 29.6mm x 18.2mm x 4.3mm.

Friday, July 22, 2016

The world's first flexible thermal sensing fingerprint sensor production

Global electronic payment market to flourish, while derivative transactions security, science and technology in biometric fingerprint identification because most credible, widely used. Panel maker Innolux and Norway NEXT Biometrics ASA jointly announced the world's first co-production flexible thermal sensing fingerprint sensor to become Amway is funding.
    
Innolux and NEXT Biometrics since 2011 jointly developed heat sensors on the glass, 2016 NEXT Biometrics have shipped one million fingerprint sensors to the well-known PC makers for its business notebooks and tablet use.
    
With the global information security problematic, biometrics demand doubled, combined Innolux flexible panel manufacturing capacity and Next Biometrics fingerprint active thermal sensing patents, successfully developed the world's first flexible fingerprint sensor, aimed at the one hundred million per year smart card (smart card), credit card or stored value card Yifu Ka opportunities, NEXT Biometrics estimated 2017 shipments per month 2 million flexible fingerprint sensor 2018 may grow to 10 million per month or more .
    
NEXT Biometrics CEO Tore Etholm-Ids? E said, there are the world's largest smart card (smart card) for our company the flexible fingerprint reader, the initiative to express interest in purchasing. Thanks Innolux R & D team to help solve the problems of thermal sensors to do the flexible panel, met in recent months significant progress in quality, we are proud to announce that Innolux NEXT Biometrics and flexible production fingerprint sensor will come in the near future time, to provide the best solutions in the global transaction security.
    
Optical group deputy general manager Yang Zhuxiang AII Business Group, said biometric technology to diversify, the first generation of optical sensor (optical sensor) module too large for customs inspection, the use of Apple's second-generation push-type capacitor chip (capacitive sensor) price is high, and the fingerprint scan area is too small, easy to have dead or offset.
    
Innolux when exposed to heat induction active NEXT Biometrics fingerprint sensor technology, pleasantly surprised. It scans the fingerprint area, high accuracy, irrespective of the quality of performance do the hard glass or flexible panel of the best, second-generation capacitive fingerprint identification chip compared, the price is quite competitive, serious problem for information security global economy, flexible fingerprint sensor to meet the smart card (smart card) market demand.

Wednesday, July 13, 2016

Embedded SuperFlash Technology SST Release

The world's leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions supplier --Microchip Technology Inc. (Microchip Technology, Inc.), through its subsidiary, Silicon Storage Technology (SST) announced the launch has been certified based on GLOBALFOUNDRIES 130 nm BCDLite technology platform, SST mask low frequency embedded SuperFlash? non-volatile memory (NVM) technology. Only four easy steps to mask the SST SuperFlash embedded storage solutions and GLOBALFOUNDRIES 'BCDLite technology combine to provide both cost-effective, high durability to supply embedded microcontroller (MCU) and industrial IC designers Flash memory solutions. Such as battery charging (5V-30V) high-capacity power supply applications, GLOBALFOUNDRIES 130 nm BCDLite platform with SST SuperFlash embedded memory function will achieve advanced battery monitoring function, accurate measurement of battery life and health.
As the industry's first combination of SST SuperFlash embedded memory technology and advanced simulation technology foundry, GLOBALFOUNDRIES of 130 nm BCDLite platform with industry-leading Rdson, which allows designers to achieve a small die size programmable single-chip power solution .
SST global marketing and business development director Vipin Tiwari said: "Embedded SuperFlash technology low mask times and advanced process nodes 130 nm BCDLite combination product opens up new potential applications, especially for the power management market, so people are excited. now, there BCDLite technology needs of customers can add SuperFlash embedded memory technology for its complex algorithms while reducing costs. "
Dave Eggleston, vice president of the Embedded Memory GLOBALFOUNDRIES, said: "We work with the customer to develop the SST-ready 130 nm modular BCD + NVM platform, providing customers with an unprecedented level of integration for all kinds of demanding battery powered applications, including unmanned aerial vehicles, intelligent motor control and normally off mobile computing. "
SST SuperFlash technology solutions based on GLOBALFOUNDRIES 130 nm BCDLite platform is now on the market, while providing comprehensive technical support from the rich resources of a custom library, the custom library contains ready-made IP modules for analog resources / power SoC optimized .
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Wednesday, July 6, 2016

Toshiba, Western Digital plans to hit 14.6 billion US dollars to expand investment in the 3D memory

Toshiba (Toshiba) and US partner Western Digital (WD), proposed a substantial increase in investment in memory in the hope that the expansion force of anti-South Korea joint enemy Samsung.
Western Digital in May after completion of acquisitions SanDisk, SanDisk and Toshiba together to undertake in Yokkaichi, Japan memory joint venture factories. According to the Nikkei news reports, Western Digital and Toshiba plans to invest in the next three years to plant 1.5 trillion yen ($ 14.6 billion), higher than the size of the previous round of investment into three, in addition to the installation of a new machine, will then build a new plant.
Yokkaichi plant this spring, is already in production 3D memory, a new round of investment the main purpose is to increase the 3D memory capacity. 3D memory of the 2017 fiscal year, accounting for five percent the proportion of factory output in 2018 will increase to eighty percent more than forecast.
Samsung is currently the leading NAND memory of last year, the total amount spent on capital investment, Samsung Semiconductor came 14.7 trillion won ($ 12.8 billion), which covers the memory and logic chips, Toshiba and Western Digital reasonable reckoning a new round of three-year investment plan, scale should be comparable with Samsung.
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Thursday, June 23, 2016

Foxconn transformation or a tremendous impact on the mobile phone industry

Recently, Foxconn announced financial technology and services platform will be launched during the year in the rich rich, it is understood that the financial services for the electronics supply chain, not pre-oriented consumers. Foxconn has made loans, financial guarantees operating license qualifications and equipment leasing and factoring and other local services. The wallet management platform in addition to the supply chain partners, will also step into the P2P net loan field. In addition, Foxconn future will establish a private equity fund of 300 million yuan, the main investment in the mainland of start-up companies.
As Apple's largest contract manufacturer, Foxconn has set up at least six financial services companies in the Chinese mainland, and to provide 10 billion yuan of funds to the periphery more than 100 component suppliers.
Media that Foxconn main purpose is to reduce dependence on Apple and get involved in high-margin business areas, at present, about 50% of Foxconn's revenue from Apple, but it may not stop there.
If you do not read Foxconn purpose and future development of financial products available, let us recall that in the previous two months, Foxconn done.
In early April this year, Foxconn to 3,890 billion yen ($ 3.5 billion) acquisition of a majority stake in Japan's Sharp. Media said Terry Gou, Foxconn hopes to embark on the road of transformation, has become an international brand-name manufacturers.
The end of May, Foxconn with the transaction price of 350 million US dollars from the hands of Microsoft bought Nokia's functional machine business.
After reviewing these two news, Foxconn is not that more mysterious ...... so let us look at Foxconn depth this series of moves, what specifically do something.
It is understood that Foxconn has made propaganda in China Taiwan region to promote team while promoting InFocus phone Nokia and Sharp's mobile phone business, Nokia and Sharp to enter China Taiwan market. In the future, Sharp will only Foxconn mobile positioning high-end products, while the InFocus as low-end products. Nokia is a functional machine product line.
In the Japanese market, Sharp Foxconn before getting smart phone business has been promoting InFocus mobile phone brands, and after obtaining Sharp smartphones, given the Sharp has a higher profile in Japan, so the focus will be the promotion of Foxconn put Japan Sharp body.
So, Foxconn layout of the mobile phone industry to get involved in the financial industry and what is the relationship?
Foxconn financial services executives believe that "Foxconn supply chain has a natural advantage, we understand better than anyone the electronic component supplier's business situation, because they are our customers." Obviously, Foxconn is helping companies solve supply chain their financial problems should be noted that, although the pre Foxconn to do just to help enterprises solve financial problems, but the official also said that if this business progress, will launch a direct-to-consumer financial products. In short, supply chain finance Foxconn to start, and then goes directly to ordinary investors sold financial products packaged loans.
Although we can not predict how Foxconn which actions carried out in the consumer finance market, but what is certain is that after the phone has a complete product line to provide consumers with online financial services such as money market funds, consumer persons and micro-credit loans allow Foxconn to reach the fastest speed in transition.
Let us imagine that. Future, have a Sharp (high-end), InFocus (low-end), Nokia (low-end functional machine) three brands of enterprises to purchase installments 0 Interest way to provide consumers with similar microcredit finance products, while providing other financial services, and he is the mobile phone industry's largest OEM manufacturers, he is Foxconn after the transition, he would cause much of an impact the industry?
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Friday, June 17, 2016

The semiconductor industry M & A wave fundamental reason Secret

Expand market share, networking opportunities, increased research and development costs, China's ambitions for the semiconductor industry, all of which contributed to the recent mergers and acquisitions wave.
Not difficult to find, the recent surge in M ​​& A activity, including the Chinese consortium "aggressive" in the new program aims to strengthen its voice in the semiconductor industry.
Except that "fanaticism", "crazy" this word is really hard to describe 2015, the semiconductor industry's huge wave of mergers and acquisitions. In the first half of 2015 a short time, it has announced the acquisition of a semiconductor involving an amount of up to $ 72.06 billion (as shown in Figure 1), which over the past five years (2010-2014) the average deal nearly six times.

2010-2015 involving an amount of mergers and acquisitions in the first half of the semiconductor
Three acquisitions in the first half of 2015 has been the 2015 merger record history. First, NXP announced in March to $ 11.08 billion in cash and stock acquisition of Freescale; in late May, Avago announced a $ 37 billion acquisition of Broadcom; only four days later (June 1), Intel said it has reached an agreement to $ 16.7 billion cash acquisition of Altera Corporation. Avago surprisingly acquisition Broadcom IC industry and so far largest acquisition.
Throwing money to take the money
In many ways, 2015 has become a perfect storm in the joint between acquisitions, mergers, major suppliers, IC manufacturers saw sales slow down its existing market segments, need to expand their business in order to keep investors. Rising costs of product development and research of advanced technology, but also need to encourage manufacturers to make larger scale and in the next five years, a higher sales rate. Things huge market potential, but also led to a major supplier of integrated circuits readjust their strategy, and quickly fill part of their portfolio missing. China's ambitious goal, namely to reduce the imports of IC devices, and even self-sufficient, which also contributed to a number of Chinese companies and investment group acquisitions.
IC industry to mature
IC Insights analysts believe that an increasing number of mergers and acquisitions will lead to major chip manufacturers and suppliers less and less, which is a major change in the supply chain, indicating the maturity of the industry. In addition to the wave of mergers and acquisitions taking place, such as lack of start any new entry point for IC manufacturers, the strong momentum into the fab-lite business model, as well as capital expenditure as a percentage of sales ratio decline trend, are harbingers of the next five years, the semiconductor industry will remodeling.
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Monday, June 13, 2016

Apple set up a subsidiary to sell surplus energy solar power

According to foreign media reports a number of technology, Apple has just founded a subsidiary of energy "Apple Energy LCC", which is registered in Delaware, but the company is located in the Apple Cupertino headquarters.
The company's assets include Nevada and California power facilities, including for providing power to the headquarters of spacecraft solar panels and fuel cells.
Apple to the US Federal Energy Regulatory Commission indicated that it should be consistent with the market price, rather than the wholesale price of electricity sales standards, because there is no significant impact on the energy industry, will not affect the market price. Apple approved the request after filing the application to start selling electricity (June 6) in 60 days.
Many states implement net metering (Net Metering), the grid allows users to have green energy generation facilities to the grid transmission of electricity, the excess power to sell a profit. Because of the large scale power generation projects Apple and quite complicated, Apple needs to set up a subsidiary to sell surplus electricity.
Apple is unlikely to sell electricity to consumers, because it requires the establishment of costly new infrastructure, transmission of electricity to the home, but also face other obstacles. Instead, the excess power during the day and sold to local power companies to help offset the evenings and rainy days is insufficient solar power grid electricity costs.
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Tuesday, April 12, 2016

Pickering once again expand PXI RF multiplexer series

As the field of electronic test and simulation of signal switches and modular instrument products leader, UK Pickering once again expanded its PXI 50Ω 600MHz RF multiplexer series product line, the new series designed 18 different configurations, including a Dual Slot PXI 32: 1 multiplexer switch module.


The latest series PXI RF multiplexing switch (40-760 series) offer several different configurations: two, four, eight groups SP4T; single, double, four SP8T; single, dual SP16T; and single group SP32T. Each multiplexers switch products also provide an automatic termination versions to optimize VSWR, thereby reducing the impact on the overall test system performance.
The series PXI RF multiplexer used in all current forefront of relay technology, the product has a very low insertion loss and VSWR. Each version is carefully designed to ensure the best performance in the 600MHz, repeatable RF switching characteristics, insertion loss metrics for each channel are very close.
By optimizing the mechanical and electronic design, to ensure the greatest degree of 40-760 series can suppress external noise coupling into the signal path.
This series is compatible with all specifications meet the PXI chassis and is compatible with mixed slot PXIe chassis. Can also be installed to Pickering's modular LXI chassis, operated via the Ethernet interface.
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Tuesday, April 5, 2016

Samsung to become the world's first mass production of 10nm level of memory of the company

Samsung Electronics announced in April 5th, has been the world's first to achieve the 10nm level process DRAM DDR4 memory particle production, but also following the first mass production in 2014 after DDR3 20nm memory particles and a feat. Samsung not disclose the specific number of new technology, only vaguely referred to as 10 nm level or 1xnm. And according to the South Korean media had reported that Samsung is 18NM, to continue leading SK Hynix and micron rivals such as.
Samsung said the new technology to overcome the DRAM Industry in a number of technical challenges, including the unique technology of unit design, four heavy exposure (QPT) technology, thin dielectric layer deposition technique and so on, and still use the existing ARF immersion lithography process, has not been opened are expensive and not mature EUV extreme ultraviolet lithography.
New 1xnm DDR4 memory particles single capacity 8GB (1GB) for frequencies up to 3200mhz, in the performance of DDR4-2400 20nm process under the can be increased by 30% compared with, also same frequency power reduce 10-20%, PC, server mainstream, large enterprise networks, high performance computing system has broad prospects, single capacity maximum do 128GB.
Later this year, Samsung will also use the new technology to produce new mobile DRAM memory particles, for the field of smart phones and peace machine.
Slow down along with the expansion of the arrival of the new technology, capacity and the growth of PC demand decline, the demand for mobile phones, memory prices will be in this year appear decline, in the second half of the year will be at least 20-30% reduction of up to 40%. Samsung 18NM joined the fray, will further stimulate the price decline.
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Monday, March 28, 2016

Olufsen & OLED and LG Electronics Co developed Bang TV

Denmark consumer electronics product company Bang & Olufsen plans with the world's largest television producer and a leading OLED and network operating system technology company LG signed a strategic technology partnership agreement.
According to the agreement, Olufsen & Bang will focus on the development of its combination with the television design, acoustics and smart home core competitiveness, and with the LG in the OLED aspects of the professional and technical combination.
Bang & Olufsen CEO Mantoni Tue said: the partnership with LG will promote the Bang & Olufsen to go to the forefront of innovation in the TV type. TV variety is currently undergoing major changes, the Bang & Olufsen is also very important. This partnership will help Olufsen & Bang to respond to the challenges associated with scale and complexity."
As Bang & Olufsen will achieve the required technical capabilities and scale of the long-term profitability of the company, the establishment of a partnership will help to resolve a major strategic challenge. This cooperation has prompted Bang & Olufsen to focus on the core competencies of acoustics and design, and further optimize the company's supply chain, development, production and service.
In partnership with Bang Olufsen & LG production of the first OLED TV is expected to launch in 2017. Partnership also includes licensing and product bundling activities, and other aspects of cooperation.
After establishing partnership, Olufsen & Bang is expected to increase gross profit and reduce the cost of production capacity. After the signing of the agreement, the next three years to save 1500-2000 million Danish crown.
In addition, Bang & Olufsen is also expected to achieve restructuring costs 1000-1500 million Danish crown, of which the 5 million Danish crown will be achieved in the fourth quarter of 2016.
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Tuesday, March 22, 2016

7Nm process will become the main battlefield of Intel electric pressure

Security plan (ARM) and Taiwan TSMC announced a multi-year agreement and cooperation for 7 nm FinFET process technology, including support of future of low power consumption, high efficiency can operation system-on-a-chip (SOC) design solutions. This agreement is a continuation of the previous Artisan ARM based entity IP 16 nm and 10 nm FinFET cooperation.
In fact, TSMC currently advanced production process process, belong to the same generation of 10 nm, 7 nm process has to catch up, even beyond the competitors Intel (Intel).
Taiwan semiconductor electric advanced process of 10 nm, 7 nm, 5 nm, and other parts, all processes are all on schedule10 nanometer process to the first quarter of 2016 finished product certification, and 10 nm / nanotechnology applications is very extensive, such as mobile phones, higher-order networking, gaming, wearable and, with the rapid transmission efficiency and low power consumption, and 7 nm is expected to 2018 Season 1 to start mass production.
It is understood, Intel estimates in 2018 to determine production 10 nm and 7 nm estimated to 2019, and Samsung Electronics (Samsung Electronics) at 10 nm progress is uncertain, TSMC in 10 / 7 nanometer generation has displayed its ambition, and launched a multi client layout.
Part of the downstream industry, said may not be using 10 nanometer products, such as 20 nm to 16 nm process transition products, but 7 nm is locked for the next generation the main goal of the, and the Taiwan product long-term contracts and arm concluded also established 7 nm in the future will become the main battlefield of International manufacturers.
According to TSMC in previous corporate open that argument, 7 nm process can be provided in the 2018 Season 1, and in accordance with the Taiwan semiconductor electrical plans, 5 nm will be launched in 2 years after 7 nm process, in about 2020 half visible clue.
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