Sunday, May 24, 2015

If acquired by AMD and Intel X86 authorization is automatically terminated



Do not look now AMD, Intel X86 market is dead in the opponent, but in the early advent of X86 architecture, Intel but the initiative to AMD X86 authorized to share because it was IBM X86 processor orders, others are entitled to X86 semiconductor company to license basic on do not exist. So now the question is, poor financial situation of AMD to become bigger, to find someone to invest is not run, it is often Samsung, Qualcomm and even AMD's acquisition of China's Godson rumors broke, then the question is, if AMD with other companies, merge or be acquired, then the licensing agreement with Intel's X86 still exist?

The question naturally there are many people in the industry concerned, regardless of what AMD are subject to change, this is a major event, but also may affect many investors make money or not. For this problem, a few days ago, AMD CFO Devinder Kumar Global Technology Conference in Jeffery did statement:

"(X86 license agreement with Intel's) is a cross-protocol, they are also used in the field X86 our innovative technologies (should refer to AMD's X86 64-bit technology), from this point on, they are partners. There are a lot of things is our first invention or the first application, it is not twelve technology is so simple, so that many people mistakenly believe the market using AMD rival technology, in fact, this is a cross-licensing agreement. "

CFO's statement was interpreted as if AMD is acquired or consolidated, or even the introduction of new investors, with Intel's X86 license is not an obstacle, which is basically equal to the potential investors, clearing the way.

These statements, however CFO AMD soon be clarified, director of public relations today clarified AMD and Intel's X86 license agreement, which is very important point is that - once AMD or Intel both companies changed ownership, whether as a merger, acquisition or accept the investment, this license agreement will automatically terminate.

In other words, AMD really keep other companies, merge or be acquired, this restriction in fact, still exist. Of course, this limit is the same time for both sides, not only is AMD, Intel acquired if being the case, the agreement will automatically terminate.

In addition, X86 license agreement originally signed between AMD and Intel have been for many years, 10 years ago, when Intel antitrust end both sides who held the cross-licensing agreement, so the CFO saying is right to some extent, especially in the 64-bit AMD X86 Let Intel low a head on the processor.

Thursday, May 21, 2015

The role of the OPC Unified Architecture in industry 4.0



 
OPC stands for Open Connectivity and is the world's most widely used standardized data exchange process automation technology. What role can play OPC UA in the industry 4.0?
The next industrial revolution, known as the industry is 4.0, characterized by individualized, highly flexible production, the extensive Integration of business processes and the coupling of products and services. In the factory of the future, all components control the production process independently, based on their extensive networking and the internet of things. Elementary component here is an OPC UA standard, interoperability at all levels allowed - to bare metal environments.
The white paper "OPC Unified Architecture and Industrial 4.0" you will learn:
• about the background of the concept of industry 4.0 and its connection to the functioning of the OPC Unified Architecture more• What challenges can be overcome with OPC• how these pioneering and complex technology can be used successfully
This download is provided to you by third parties (eg the manufacturer) or by our editorial staff free of charge. If you have problems opening the whitepapers, please disable your pop-up blocker for this site.

Tuesday, May 19, 2015

Process oriented solutions are in great demand at ASM

ASM Assembly Systems draws upon completion of Trade Fair SMT Hybrid Packaging 2015 to a positive conclusion. For the first time, the printer specialist DEK and the equipping of SIPLACE experts in Nuremberg presented at a joint stand.

On the SMT Hybrid Packaging ASM Assembly Systems was waiting with a complete SMT production line for placing on super small 0201 components, consisting of a DEK stencil printer of the type Horizon 03iX and SIPLACE SX family.

Continuous were process experts from DEK and SIPLACE engrossed in discussions with customers to beantworten.Kernthemen questions about process improvements in electronics manufacturing were here with great workflow solutions such as the Material Manager, the Setup Assistant or the SiCluster Multiline even service tools such as the new nano Ultra-DEK stencil and the upgrade kits for feeder or the Head care ward of SIPLACE.

For much talk about the presentation of the first mounting solution caused the midspeed segment: E by SIPLACE. This ASM Assembly Systems addressed first new target groups and applications outside the high-end segment. The team of the Distributor SmartRep, who presented the E-series at its own stand, still recorded the first orders from Germany, Austria and Switzerland at the fair.

"Just one year after the integration teams of DEK and SIPLACE are grown together very well and already presented joint solutions and projects," said Gabriela Reckewerth pleased, Global Marketing Director at ASM Assembly Systems, the successful trade fair appearance: "The goal is clear: We want to provide continuous line optimized solutions. The feedback from the fair shows that we are on the right track and can give comprehensive answers to the requirements in electronics manufacturing. "

It was noteworthy that the focus of the visits was not only on machines but primarily on integrated processes. This emphasizes Hubert Egger, Product Marketing Manager at SIPLACE team: "Technically the processes occur more and more to the fore. The customers are asking for integrated solutions and for ASM As a manufacturer next to Best-in-Class printer and placement also advanced software and in-depth process knowledge. Only the perfect interaction of all components ensures process-optimized, tailored to the specific needs of individual electronics manufacturing solutions. "

For the Productronica, the world trade fair for electronics production in the fall, Egger announced the intention to expand the theme of the Smart Factory, which had already been virulent at the SMT Hybrid Packaging yet.

Friday, May 15, 2015

16-bit DSC allows smaller power supplies with higher switching frequencies

The Digital Signal Controllers (DSCs) from Microchip have been designed for the implementation of sophisticated nonlinear, predictive and adaptive control algorithms at higher switching frequencies. For the first time, a flash memory for live updates without interruption in running systems has been integrated.

Microchip announces the dsPIC33EP "GS" family before 14 new Digital Signal Controllers (DSCs), which are suitable for the implementation of sophisticated nonlinear, predictive and adaptive control algorithms at higher switching frequencies. These algorithms enable not only more efficient power supplies, they also have better overall specifications.

Block diagram of microcontroller family dsPIC33EP- "GS" from Microchip
Block diagram of microcontroller family dsPIC33EP- "GS" from Microchip (image: Microchip)
Higher switching frequencies allow the development in turn physically smaller power supplies with higher component density at a lower cost. Compared to the previous generation of DSCs, the new "GS" family less than half the latency when it is used in an expansion joint with three poles and three zeros, and needs regardless of the application up to 80% less power.

The dsPIC33EP- "GS" family also comes up with special properties, such as the flash memory for live updates, which is particularly important for high availability or uninterruptible systems. The firmware of a power supply and the active calculation code for the compensator can thus be replaced by live update during operation and continuous control. A short presentation, see www.microchip.com/Presentation and in our gallery.

The technical basic parameters of the new digital power design Controlle

Other key features of the family are up to five 12-bit ADCs with 22 ADC inputs. You have a total throughput of 16 mega samples per second (Msps) and an ADC latency of 300 ns.

Furthermore, 12-bit DACs available for each of the four analog comparators for designs with higher accuracy. Two programmable analog amplifier on the chip are designed for current measurement and other precision measurements and help to save external components and board space and reduce costs.

Wednesday, May 13, 2015

Infra Red Light MAKE new production processes POSSIBLE

The production of new sandwich structures, such as those used for example for modern aircraft and vehicles require different heating processes. An infrared system from Heraeus Noblelight offers the necessary flexibility for both trials and for later production. From the Institute of Lightweight Structures and Polymer Technology (ILK) of the TU Dresden as could new combination method such as the thermal pressing, be improved. The ILK has the novel manufacturing processes so implemented that they are now economically viable and are nearing production readiness.

Foam technologies are used increasingly in the future as can improve the performance of components with the new composite technologies and new applications are possible. The requirements for the components are going to increase the functionality and integration capability, while reducing component weight and manufacturing costs.

When thermopressing organic sheets are connected to foam board. For this, the sandwich of thermoplastic cover layer and core material is produced and transformed directly in the pressing tool. Heated semi-finished products are transported in a pressing tool with foam panels, which are covered above and below with Organoblechzuschnitten. When the tool is the outer layers and the foam core are formed and pressed to form a sandwich structure.
Infrared systems transfer heat without contact medium, by means of electromagnetic waves that produce heat directly in the material.

Infrared systems provide a very flexible adjustment and control of power. They also have very short response times, short-wave and carbon emitters react within one to three seconds. This makes heat controllable and helps to realize temperature profiles.

This flexibility of infrared systems makes them an ideal source of heat in the design phase of new technologies.

The technology group Heraeus headquartered in Hanau, is a 1851 founded and today the world's leading family. With expertise, innovation orientation, operational excellence and entrepreneurial leadership, we strive to improve our economic performance continuously.

We provide quality solutions for our customers and sustainably strengthen its competitiveness by combining material expertise with technology know-how. Our ideas are based on themes such as environment, energy, health, mobility and industrial applications. Our portfolio ranges from components to matched material systems. They are used in diverse industries, including steel, electronics, chemicals, automotive and telecommunications.

In fiscal 2014, Heraeus generated product revenues of € 3.4 billion and a precious metal trading revenues of € 12.2 billion. With around 12,600 employees worldwide in more than 100 locations in 38 countries worldwide, Heraeus holds a leading position in its global markets.

Heraeus Noblelight GmbH with its headquarters in Hanau and with subsidiaries in the USA, UK, France, China and Australia one of the world's market and technology leaders in the production of specialist light sources and systems. Heraeus Noblelight had 2014 annual revenues of € 137.3 million and employed 884 people worldwide. The company develops, manufactures and markets infrared and ultraviolet emitters, systems and solutions for applications in industrial manufacture, environmental protection, medicine and cosmetics, research and analytical laboratories.

Sunday, May 10, 2015

Fitbit launch IPO or a wearable device first listed company in the field

Fitbit wearable device company today officially submitted to the United States on the NYSE IPO application, plans $ 100 million public financing (but the amount may change), and have been identified under the ticker symbol FIT. Morgan Stanley, Deutsche Bank and Merrill Lynch will be the lead underwriters listed Fitbit.

Fitbit Founded in 2007, precisely because of earlier entered the field of wearable devices, so set up a certain advantage. According to its prospectus disclosed that in 2014 Fitbit sold a total of 10.9 million sets of wearable devices, more than double the 2013's. Nearly two years of its financial situation is very good, in 2014 turnover reached 740 million, and net profit of 130 million.

Data analysis reports in addition to selling hardware products, Fitbit there is a piece of the revenue from user fees, the annual fee is $ 49.99. As of the first quarter of this year, Fitbit active users of the service charge of 950 million people.

Fitbit's current flagship product sports bracelet Fitbit Charge and Fitbit Flex, There is also a smart watch Fitbit Surge.

As more and more companies began to enter the field of smart wearable devices, Fitbit will face more intense competition. Apple and other large companies, especially admission, Fitbit will form a great pressure. Late last year, Apple had the shelf Fitbit own line of products within the store.

Fitbit total financing of $ 80 million on the history, the current co-founder of two JamesPark (CEO) and EricFriedman (CTO) owned 10.9% stake in the company. Their investors FoundryGroup, TrueVentures and Softbank shares accounted for 28.9%, 22.4% and 5.6% respectively.

Friday, May 8, 2015

Linxens complete RFID antenna specialist KnL acquisition

Dedicated to the design and manufacture connectors for smart cards worldwide leader Linxens KnL Group has just completed the acquisition.

KnL Group in 2010 was founded by Yannick Zoccola managing director of this company, located in Bangkok, Thailand. This company specializes in radio frequency identification (RFID) and antenna embedded in the manufacture thereof, and these products are generally used for bank cards, ID cards, access cards and transportation cards and passports.

Christophe Duverne Linxens Group CEO, said: "This acquisition is Linxens KnL Group an important step and will help strengthen our momentum and we are happy for our products join KnL talent, technology and products, and are convinced that this. It will help us accelerate our ambitions in contactless products in the market. "

Yannick Zoccola KnL director, general manager, said: "KnL antenna has been developed in terms of a set of unique capabilities and we are pleased to own expertise and the expertise of Linxens binding, and accelerating the development of our business in the medium to long term, it will. Our products and services can bring a more reasonable choice for our customers. "Yannick Zoccola will continue to serve his current role, and add Linxens management team.

Tuesday, May 5, 2015

Perfect film for the chip of the future

Chip developers know that the time is not far off, as their raw material silicon will reach its limits. The probate recipe, more and more, always accommodate smaller components to the processors, then almost only deliver Committee. Alternative materials and alternative principles must therefore forth.

Particularly promising is considered a class of certain metal compounds with the best known representatives of molybdenum disulfide. Similar to the "miracle material" graphene They can be prepared in stable thickness layers only a few atoms. However, in contrast to carbon-based graphene they reveal a trait that she is predestined for use in computer chips: They are like silicon semiconductors, ie, their electrical conductivity can be changed within a split second. That's why they come, at least from a theoretical point of most likely for use in chip into consideration.

But their semiconductor property is just one of the features associated with these "transition metal dichalcogenides" points. Thanks to some exotic properties they exist also for alternative computer concepts, such as on the basis of electron spins (spintronics) or other atomic phenomena (Valleytronik, Orbitronik). Some scientists see their applications on the other hand more in optoelectronics, high-speed communications or alternatively as data or energy storage. And researchers have long not yet explored the full range of possibilities offered by these materials.

Nanolayers in Huge
One application was previously opposed mainly the disabled manufacturing process. He provided the scientists little more than small pieces of material. Such samples are usually wins by peeling method - of larger multi layer blocks most precise individual layers are removed. Using aggressive starting chemicals can also produce films by deposition from the gas phase. But experts say it is unlikely that with the hitherto existing methods pops useful for the computer industry.

Construction of molybdenum disulfide
Transition-metal dichalcogenides such as molybdenum disulfide are not true 2-D-materials, because their molecules form other than the planar graphs a three-dimensionally structured monolayer in which the Calkogen, here the sulfur, protrudes from the plane.
More promising sounds a new procedure that has a team to Jiwoong Park from Cornell University in Ithaca now presented. Transition metal dichalcogenides always consist of a metal such as molybdenum or tungsten, as well as one of the three elements sulfur, selenium or tellurium. Their molecules together form a three-layer structure in which the metal is flanked at the center of the overlying and underlying second element.

Park and colleagues have now succeeded to produce such precise three atoms thick layers of molybdenum disulfide (MoS2) and tungsten disulfide (WS2) - not in micron size, but in round slices of rich ten centimeters in diameter. They are therefore more than 100 million times wider than it is thick.

"There are a lot of people who are trying to breed such individual layers on a large scale, including me", the materials researcher Georg Duesberg says from Trinity College in Dublin against "Nature". "As it is, who it now really done."

Hot full steam process
The new method essentially corresponds to the conventional, ie the so-called chemical vapor deposition, however, includes a central gimmick that is to take other gaseous starting materials than previously customary, explained Park. The corresponding molecules (Mo (CO) 6 and W (CO) 6 and S (CH2CH3) 2 as sulfur supplier) each contain only one atom of the desired substance. With these gases, the layers are grown in 26 hours under 550 degrees Celsius on a silica-coated silicon wafer. As proved decisive, while continuously supplying hydrogen gas to prevent carbonaceous impurities in the final product.

Researchers used now gone one better and produced on this blank a total of 200 field-effect transistors, a standard component of modern electronic circuits. The review found that only two of them were not working as intended, what they gave a success rate of 99 percent. It shows that an error-free layer had grown to almost the entire surface.

The new computer era
According to researchers, it should be possible to cover a layer with a layer of silicon dioxide and again to undergo the process, so that a sandwich structure. One directed to the appropriate places a conductive links between the layers, to three-dimensional circuits would be realized, explained Park and colleagues. Also experiments with laminates from MoS2 and graphs or boron nitride have already delivered promising results.

Process too "inflexible"?
Before too much euphoria, however, warn Tobi Marks and Mark Hersam of Northwestern University in Evanston, Illinois, in their otherwise very positive accompanying Comment: The practical application still stood against a number of obstacles. Thus, the charge carriers in the three atoms thick layers move more slowly than in a conventional example silicon or even graphene, which theoretically limits the computer's speed. Also comply with their electronic properties not yet completely the wishes of chip manufacturers that indeed must, for example think of the energy consumption of their devices.

Due to the high production temperature, the layers may also not be created on flexible carriers. Here are the ultra-thin 2-D materials just play to their strengths here. However, there may be would find ways to create the MoS2 on silica and then transfer them to new surfaces, write Marks and Hersam.

And who knows, maybe the true "killer app" of these materials is so in an entirely different field. An exotic effects no shortage. According to Marks and Hersam to grain boundaries can be moved within the layer of electric shock, bringing the lead resistance can be deliberately manipulated - it creates a "memristor", and from there it is practically only a very short distance to the electronic nerve cell in the computer.

Monday, May 4, 2015

Ultra-thin LCD VS 64% of the surface of the liquid crystal former consumer preferences



2015's TV market, ultra-high definition picture quality on the market is still dominant, but the design also became the new consumer benchmark. In addition to the new form of curved LCD TV market today is more thickness comparable with the flagship smartphone of ultra-thin TV, what is more recognized consumer trends?
Recently, the authority of the domestic research firm AVC Openwave cloud Posted "2015 TV product design research report" that TV consumption trends and the integration of home design, as consumers buy new television standard. The report also indicates the relative surface LCD TV, ultra-thin TV consumers have a better understanding, more than 60% of consumers are more inclined to choose the ultra-thin TV.

2014 experienced a development boom 4K Ultra HD, pure display technology upgrading has been difficult to reflect the panel makers to pursue differentiated, panel makers are turning to TV design. Promote "more ergonomic 'curved LCD TV, and the pursuit of thinner and lighter ultra-thin television emerged as the two design direction of the current panel market.

AVC report shows that both the ultra-thin TV or curved LCD TV, consumers of their level of understanding of the whole are low, but consumers about the ultra-thin TVs and surfaces LCD TVs concepts, without considering the price of the premise, the relative surface of the liquid crystal TV, 64 percent of consumers prefer ultra-thin TV, the tendency of consumers accounted for only 23% of surface TV, ultra-thin TV as all income groups most consumer choice.

AVC data analysis, design better and more innovative, more high-end products, technology and more innovation, more easily matched with home decoration style, ultra-thin TV consumers tend to choose four reasons. Among them, more innovative product design, technology and product innovation is more and more high-end consumers in the choice of ultra-thin TV's core demands, but also consumers that ultra-thin TV LCD TVs more competitive relative to the surface of the product features.

In addition, the report also shows that in the minds of consumers, relative to the surface of the liquid crystal TV, ultra-thin TV with a relatively higher premium capacity, higher market value. 38.3% of consumers to accept prices above the surface of ultra-thin TV LCD TV prices, and ultra-thin TV prices lower than the acceptable proportion of consumers curved LCD TV prices dropped 25.3%.

Next higher price diversified television popular TV applications

Picture quality, new features and design are the three core elements of ultra-thin TV consumer preferences in Key considerations when buying a TV. The report shows that the design, the external shape (curved & flat), material and product thickness of the material is ultra-thin television preferences of the three demands of consumers in terms of product appearance. AVC The report notes that the ultra-thin TV brings minimalist design also an excellent way to meet the trend of home design. In terms of price, consumers are more than 1 million TV products have begun to show more favor, showing that the market trend of strong demand for high-end products.

Not difficult to see, ultra-high definition picture quality and design, will be the main direction of development of television the next few years. In addition to 4K, another keyword is "ultra-thin" no doubt. As the world's largest television market, China is expected to be formed in 2017, the market size of 45.35 million units, including ultra-thin TV will reach 7 million units, accounting for 15.4%, an average annual growth rate of 165% of rapid development. In 2016, the ultra-thin TV market will reach 3.8 million units, will completely throw off the market size is 300 million units of curved LCD TV, which also means that ultra-thin TV market trends in China will become the largest LCD TV market.

Trend of ultra-thin TV market at the beginning of this year will win the favor of consumers. In the upcoming May Day appliance sales season, the reporter found that ultra-thin television has become the supermarkets and TV manufacturers, "meat and potatoes", LG, Skyworth, Konka, Changhong and other manufacturers have introduced complete ultra-thin TV Promotions activities. Which is no shortage of heavy models added, both the thickness of only 55 inches G9200 Air 7.5mm Skyworth, but also has applications Zhen wide color gamut technology of LG 65 英寸 UF9500. In addition, Konka Yi TV · Slim2 8900S, Changhong CHiQ Q2R etc. are also ultra-thin star product. Ultra-thin TV season May Day performance worth the wait.