GreenPeak attention to partners in China to build a new eco-smart home business applications

Founder of the world's leading smart home Semiconductor / Enterprise GreenPeak Technologies and CEO Cees Links represent a reporter conference in Grand Hyatt Beijing recently held, GreenPeak Technologies is seeking Chinese partners to jointly promote and create objects Smart Home ecosystem networked platform, work potential partners to accelerate the development of smart city projects. Said Mr. Cees Links, GreenPeak China witnessed an important step towards the Internet of Things. GreenPeak solutions not only solve the aging of the huge Chinese demand, but not enough to fill the number of pension institutions of challenges.

According to the world's leading market research firm Research and Markets report on China's smart home industry: China smart home from 2011 to 2014, annual growth of 30% in 2014, smart home applications and products overall value reached 28.61 billion yuan, compared with 2013 increased by 39%.
Things era many Chinese telecom operators, service providers and original equipment manufacturers (OEMs) in China coming to seek opportunities. For the semiconductor industry, networking equipment based on market opportunities on behalf of the IEEE 802.15.4 and ZigBee technology trillions. Open global wireless networking standard allows a single smart devices are interconnected, lay the foundation for the Internet of Things, and to further improve the comfort, safety and efficiency of daily life.

GreenPeak Technologies founder and CEO Cees Links, said: "The current number of elderly people in China have nearly 200 million, of which about 50 million elderly people living alone to solve China increasingly serious aging problem, the key lies in the effective use of the smart home. solution, expanded use of things to install and run more economical, easier to scale .GreenPeak the social skills, learned to recognize the behavior of cloud-based self-learning ability, as well as analysis algorithm is applied to the smart home solutions, and is committed to using cutting-edge ZigBee technology and strategic cooperation model for the development of China's intelligent home networking ecosystem and contribute and really smart to upgrade the average family to family. "
Chinese social media users is most concentrated. This makes it possible to take advantage of the rapid development of China's Internet of Things technology, social media and online communications capability into the smart home applications, and it also allows families with children and the elderly in the premise of ensuring the privacy of living safely share information . Dispersed throughout the home ZigBee sensors can quietly collect data upon detection of abnormal behavior or unexpected situation, the system through social networks, such as micro letters and QQ, immediately notify the family or friends to take the necessary measures. Smart Home system makes the elderly feel more secure and increase the length of time an independent home for the elderly. Even the elderly and children separated in different cities, the smart home system will also enhance communication efficiency, and shorten the distance between the elderly and their children.

The growing strategic partnership

GreenPeak since last year opened an office in Hong Kong, China, to continue doing business in China first-tier cities, and set up offices in Beijing. In order to better serve our customers, partners, service providers and smart home ecosystem, GreenPeak plans to set up an office in Shanghai.

In March, GreenPeak with ZTE ZTE's Health Technology Co., Ltd. (ZTE Health) signed a cooperation agreement to jointly develop smart home applications. The aim of this cooperation is based on China as a starting point, to provide intelligent solutions to the problem of aging of the world. The thrust of the strategic business alliance is possible to extend the time for the elderly to live independently at home, but also make caregivers and families more peace of mind. By partnering with ZTE Health Technology Co., Ltd., GreenPeak hopes to create a more secure environment for the elderly who will be the home of independent elderly prolonged 5--10 years. Compared to the construction of the pension agency, independent lifestyle at home for Chinese families and local governments to ease enormous economic burden.

2014, GreenPeak with the world's leading wireless module solutions for design and manufacturing experts USI Electronics to develop a sensor device of a high-performance low-cost ZigBee module for the intelligent home. The new ring Asahi Electronic ZigBee module so that the original is not good at USI ZigBee technology electronic equipment development partners can quickly deploy and implement equipment upgrades, greatly reducing the time to market of its equipment, so smart home devices more widely and more affordable.

If acquired by AMD and Intel X86 authorization is automatically terminated

Do not look now AMD, Intel X86 market is dead in the opponent, but in the early advent of X86 architecture, Intel but the initiative to AMD X86 authorized to share because it was IBM X86 processor orders, others are entitled to X86 semiconductor company to license basic on do not exist. So now the question is, poor financial situation of AMD to become bigger, to find someone to invest is not run, it is often Samsung, Qualcomm and even AMD's acquisition of China's Godson rumors broke, then the question is, if AMD with other companies, merge or be acquired, then the licensing agreement with Intel's X86 still exist?

The question naturally there are many people in the industry concerned, regardless of what AMD are subject to change, this is a major event, but also may affect many investors make money or not. For this problem, a few days ago, AMD CFO Devinder Kumar Global Technology Conference in Jeffery did statement:

"(X86 license agreement with Intel's) is a cross-protocol, they are also used in the field X86 our innovative technologies (should refer to AMD's X86 64-bit technology), from this point on, they are partners. There are a lot of things is our first invention or the first application, it is not twelve technology is so simple, so that many people mistakenly believe the market using AMD rival technology, in fact, this is a cross-licensing agreement. "

CFO's statement was interpreted as if AMD is acquired or consolidated, or even the introduction of new investors, with Intel's X86 license is not an obstacle, which is basically equal to the potential investors, clearing the way.

These statements, however CFO AMD soon be clarified, director of public relations today clarified AMD and Intel's X86 license agreement, which is very important point is that - once AMD or Intel both companies changed ownership, whether as a merger, acquisition or accept the investment, this license agreement will automatically terminate.

In other words, AMD really keep other companies, merge or be acquired, this restriction in fact, still exist. Of course, this limit is the same time for both sides, not only is AMD, Intel acquired if being the case, the agreement will automatically terminate.

In addition, X86 license agreement originally signed between AMD and Intel have been for many years, 10 years ago, when Intel antitrust end both sides who held the cross-licensing agreement, so the CFO saying is right to some extent, especially in the 64-bit AMD X86 Let Intel low a head on the processor.

The role of the OPC Unified Architecture in industry 4.0

 OPC stands for Open Connectivity and is the world's most widely used standardized data exchange process automation technology. What role can play OPC UA in the industry 4.0?
The next industrial revolution, known as the industry is 4.0, characterized by individualized, highly flexible production, the extensive Integration of business processes and the coupling of products and services. In the factory of the future, all components control the production process independently, based on their extensive networking and the internet of things. Elementary component here is an OPC UA standard, interoperability at all levels allowed - to bare metal environments.
The white paper "OPC Unified Architecture and Industrial 4.0" you will learn:
• about the background of the concept of industry 4.0 and its connection to the functioning of the OPC Unified Architecture more• What challenges can be overcome with OPC• how these pioneering and complex technology can be used successfully
This download is provided to you by third parties (eg the manufacturer) or by our editorial staff free of charge. If you have problems opening the whitepapers, please disable your pop-up blocker for this site.

Process oriented solutions are in great demand at ASM

ASM Assembly Systems draws upon completion of Trade Fair SMT Hybrid Packaging 2015 to a positive conclusion. For the first time, the printer specialist DEK and the equipping of SIPLACE experts in Nuremberg presented at a joint stand.

On the SMT Hybrid Packaging ASM Assembly Systems was waiting with a complete SMT production line for placing on super small 0201 components, consisting of a DEK stencil printer of the type Horizon 03iX and SIPLACE SX family.

Continuous were process experts from DEK and SIPLACE engrossed in discussions with customers to beantworten.Kernthemen questions about process improvements in electronics manufacturing were here with great workflow solutions such as the Material Manager, the Setup Assistant or the SiCluster Multiline even service tools such as the new nano Ultra-DEK stencil and the upgrade kits for feeder or the Head care ward of SIPLACE.

For much talk about the presentation of the first mounting solution caused the midspeed segment: E by SIPLACE. This ASM Assembly Systems addressed first new target groups and applications outside the high-end segment. The team of the Distributor SmartRep, who presented the E-series at its own stand, still recorded the first orders from Germany, Austria and Switzerland at the fair.

"Just one year after the integration teams of DEK and SIPLACE are grown together very well and already presented joint solutions and projects," said Gabriela Reckewerth pleased, Global Marketing Director at ASM Assembly Systems, the successful trade fair appearance: "The goal is clear: We want to provide continuous line optimized solutions. The feedback from the fair shows that we are on the right track and can give comprehensive answers to the requirements in electronics manufacturing. "

It was noteworthy that the focus of the visits was not only on machines but primarily on integrated processes. This emphasizes Hubert Egger, Product Marketing Manager at SIPLACE team: "Technically the processes occur more and more to the fore. The customers are asking for integrated solutions and for ASM As a manufacturer next to Best-in-Class printer and placement also advanced software and in-depth process knowledge. Only the perfect interaction of all components ensures process-optimized, tailored to the specific needs of individual electronics manufacturing solutions. "

For the Productronica, the world trade fair for electronics production in the fall, Egger announced the intention to expand the theme of the Smart Factory, which had already been virulent at the SMT Hybrid Packaging yet.

16-bit DSC allows smaller power supplies with higher switching frequencies

The Digital Signal Controllers (DSCs) from Microchip have been designed for the implementation of sophisticated nonlinear, predictive and adaptive control algorithms at higher switching frequencies. For the first time, a flash memory for live updates without interruption in running systems has been integrated.

Microchip announces the dsPIC33EP "GS" family before 14 new Digital Signal Controllers (DSCs), which are suitable for the implementation of sophisticated nonlinear, predictive and adaptive control algorithms at higher switching frequencies. These algorithms enable not only more efficient power supplies, they also have better overall specifications.

Block diagram of microcontroller family dsPIC33EP- "GS" from Microchip
Block diagram of microcontroller family dsPIC33EP- "GS" from Microchip (image: Microchip)
Higher switching frequencies allow the development in turn physically smaller power supplies with higher component density at a lower cost. Compared to the previous generation of DSCs, the new "GS" family less than half the latency when it is used in an expansion joint with three poles and three zeros, and needs regardless of the application up to 80% less power.

The dsPIC33EP- "GS" family also comes up with special properties, such as the flash memory for live updates, which is particularly important for high availability or uninterruptible systems. The firmware of a power supply and the active calculation code for the compensator can thus be replaced by live update during operation and continuous control. A short presentation, see www.microchip.com/Presentation and in our gallery.

The technical basic parameters of the new digital power design Controlle

Other key features of the family are up to five 12-bit ADCs with 22 ADC inputs. You have a total throughput of 16 mega samples per second (Msps) and an ADC latency of 300 ns.

Furthermore, 12-bit DACs available for each of the four analog comparators for designs with higher accuracy. Two programmable analog amplifier on the chip are designed for current measurement and other precision measurements and help to save external components and board space and reduce costs.

Infra Red Light MAKE new production processes POSSIBLE

The production of new sandwich structures, such as those used for example for modern aircraft and vehicles require different heating processes. An infrared system from Heraeus Noblelight offers the necessary flexibility for both trials and for later production. From the Institute of Lightweight Structures and Polymer Technology (ILK) of the TU Dresden as could new combination method such as the thermal pressing, be improved. The ILK has the novel manufacturing processes so implemented that they are now economically viable and are nearing production readiness.

Foam technologies are used increasingly in the future as can improve the performance of components with the new composite technologies and new applications are possible. The requirements for the components are going to increase the functionality and integration capability, while reducing component weight and manufacturing costs.

When thermopressing organic sheets are connected to foam board. For this, the sandwich of thermoplastic cover layer and core material is produced and transformed directly in the pressing tool. Heated semi-finished products are transported in a pressing tool with foam panels, which are covered above and below with Organoblechzuschnitten. When the tool is the outer layers and the foam core are formed and pressed to form a sandwich structure.
Infrared systems transfer heat without contact medium, by means of electromagnetic waves that produce heat directly in the material.

Infrared systems provide a very flexible adjustment and control of power. They also have very short response times, short-wave and carbon emitters react within one to three seconds. This makes heat controllable and helps to realize temperature profiles.

This flexibility of infrared systems makes them an ideal source of heat in the design phase of new technologies.

The technology group Heraeus headquartered in Hanau, is a 1851 founded and today the world's leading family. With expertise, innovation orientation, operational excellence and entrepreneurial leadership, we strive to improve our economic performance continuously.

We provide quality solutions for our customers and sustainably strengthen its competitiveness by combining material expertise with technology know-how. Our ideas are based on themes such as environment, energy, health, mobility and industrial applications. Our portfolio ranges from components to matched material systems. They are used in diverse industries, including steel, electronics, chemicals, automotive and telecommunications.

In fiscal 2014, Heraeus generated product revenues of € 3.4 billion and a precious metal trading revenues of € 12.2 billion. With around 12,600 employees worldwide in more than 100 locations in 38 countries worldwide, Heraeus holds a leading position in its global markets.

Heraeus Noblelight GmbH with its headquarters in Hanau and with subsidiaries in the USA, UK, France, China and Australia one of the world's market and technology leaders in the production of specialist light sources and systems. Heraeus Noblelight had 2014 annual revenues of € 137.3 million and employed 884 people worldwide. The company develops, manufactures and markets infrared and ultraviolet emitters, systems and solutions for applications in industrial manufacture, environmental protection, medicine and cosmetics, research and analytical laboratories.

Fitbit launch IPO or a wearable device first listed company in the field

Fitbit wearable device company today officially submitted to the United States on the NYSE IPO application, plans $ 100 million public financing (but the amount may change), and have been identified under the ticker symbol FIT. Morgan Stanley, Deutsche Bank and Merrill Lynch will be the lead underwriters listed Fitbit.

Fitbit Founded in 2007, precisely because of earlier entered the field of wearable devices, so set up a certain advantage. According to its prospectus disclosed that in 2014 Fitbit sold a total of 10.9 million sets of wearable devices, more than double the 2013's. Nearly two years of its financial situation is very good, in 2014 turnover reached 740 million, and net profit of 130 million.

Data analysis reports in addition to selling hardware products, Fitbit there is a piece of the revenue from user fees, the annual fee is $ 49.99. As of the first quarter of this year, Fitbit active users of the service charge of 950 million people.

Fitbit's current flagship product sports bracelet Fitbit Charge and Fitbit Flex, There is also a smart watch Fitbit Surge.

As more and more companies began to enter the field of smart wearable devices, Fitbit will face more intense competition. Apple and other large companies, especially admission, Fitbit will form a great pressure. Late last year, Apple had the shelf Fitbit own line of products within the store.

Fitbit total financing of $ 80 million on the history, the current co-founder of two JamesPark (CEO) and EricFriedman (CTO) owned 10.9% stake in the company. Their investors FoundryGroup, TrueVentures and Softbank shares accounted for 28.9%, 22.4% and 5.6% respectively.