ASM Assembly Systems draws upon completion of Trade Fair SMT Hybrid Packaging 2015 to a positive conclusion. For the first time, the printer specialist DEK and the equipping of SIPLACE experts in Nuremberg presented at a joint stand.
On the SMT Hybrid Packaging ASM Assembly Systems was waiting with a complete SMT production line for placing on super small 0201 components, consisting of a DEK stencil printer of the type Horizon 03iX and SIPLACE SX family.
Continuous were process experts from DEK and SIPLACE engrossed in discussions with customers to beantworten.Kernthemen questions about process improvements in electronics manufacturing were here with great workflow solutions such as the Material Manager, the Setup Assistant or the SiCluster Multiline even service tools such as the new nano Ultra-DEK stencil and the upgrade kits for feeder or the Head care ward of SIPLACE.
For much talk about the presentation of the first mounting solution caused the midspeed segment: E by SIPLACE. This ASM Assembly Systems addressed first new target groups and applications outside the high-end segment. The team of the Distributor SmartRep, who presented the E-series at its own stand, still recorded the first orders from Germany, Austria and Switzerland at the fair.
"Just one year after the integration teams of DEK and SIPLACE are grown together very well and already presented joint solutions and projects," said Gabriela Reckewerth pleased, Global Marketing Director at ASM Assembly Systems, the successful trade fair appearance: "The goal is clear: We want to provide continuous line optimized solutions. The feedback from the fair shows that we are on the right track and can give comprehensive answers to the requirements in electronics manufacturing. "
It was noteworthy that the focus of the visits was not only on machines but primarily on integrated processes. This emphasizes Hubert Egger, Product Marketing Manager at SIPLACE team: "Technically the processes occur more and more to the fore. The customers are asking for integrated solutions and for ASM As a manufacturer next to Best-in-Class printer and placement also advanced software and in-depth process knowledge. Only the perfect interaction of all components ensures process-optimized, tailored to the specific needs of individual electronics manufacturing solutions. "
For the Productronica, the world trade fair for electronics production in the fall, Egger announced the intention to expand the theme of the Smart Factory, which had already been virulent at the SMT Hybrid Packaging yet.