ON Semiconductor Introduces Automotive Power Integration Module program

Promote energy efficiency and innovative Semiconductor (ON Semiconductor), further expansion of automotive power integrated module (PIM) product line, launched STK984-190-E. The module is optimized for driving three-phase brushless DC motor (BLDC) for modern automotive applications, comprising six 40 V, 30 A MOSFET configured as a three-phase bridge, and an additional 40 V, 30 A high-side reverse battery protection MOSFET. The MOSFET is mounted onto a direct bond copper (DBC) substrate, resulting in a compact module with excellent heat dissipation, it is only as effective as discrete programs half the board space.
The module is suitable for 12 V automotive motor drive applications, rated power of 300 W, electric pumps, fans and windshield wipers. Using motor controller designers to incorporate such LV8907UW, can create energy efficient BLDC solution with best-in thermal performance and built-in diagnostics, and ultra-small PCB, saving critical dimensions and weight.
Use this module can significantly reduce component count and BOM cost. DBC substrate thermal resistance reduced, thereby reducing the operating temperature of the MOSFET. By reducing the thermal cycling during temperature changes, which reduces the power consumption and increase reliability. Insulation provided by the DBC substrate also enhance the reliability. STK984-190-E specified operating temperature range of -40 ° C to 150 ° C. All integrated MOSFET through AEC-Q101 certification.
Chris Chey, general manager of ON Semiconductor System Solutions Division, said:. "Develop an efficient BLDC drive program usually takes at least 13-15 discrete components, while less than half the number of car components STK984-190-E power modules required in addition to a compact size, STK984-190-E support robust thermal performance with a smaller heat sink. this enables the size and weight of the system is significantly reduced, which means engineers can fully address the challenges currently facing with regard to improve fuel economy and overcoming space constraints. "
STK984-190-E lead-free DIP-S3 package measuring 29.6mm x 18.2mm x 4.3mm.

The world's first flexible thermal sensing fingerprint sensor production

Global electronic payment market to flourish, while derivative transactions security, science and technology in biometric fingerprint identification because most credible, widely used. Panel maker Innolux and Norway NEXT Biometrics ASA jointly announced the world's first co-production flexible thermal sensing fingerprint sensor to become Amway is funding.
    
Innolux and NEXT Biometrics since 2011 jointly developed heat sensors on the glass, 2016 NEXT Biometrics have shipped one million fingerprint sensors to the well-known PC makers for its business notebooks and tablet use.
    
With the global information security problematic, biometrics demand doubled, combined Innolux flexible panel manufacturing capacity and Next Biometrics fingerprint active thermal sensing patents, successfully developed the world's first flexible fingerprint sensor, aimed at the one hundred million per year smart card (smart card), credit card or stored value card Yifu Ka opportunities, NEXT Biometrics estimated 2017 shipments per month 2 million flexible fingerprint sensor 2018 may grow to 10 million per month or more .
    
NEXT Biometrics CEO Tore Etholm-Ids? E said, there are the world's largest smart card (smart card) for our company the flexible fingerprint reader, the initiative to express interest in purchasing. Thanks Innolux R & D team to help solve the problems of thermal sensors to do the flexible panel, met in recent months significant progress in quality, we are proud to announce that Innolux NEXT Biometrics and flexible production fingerprint sensor will come in the near future time, to provide the best solutions in the global transaction security.
    
Optical group deputy general manager Yang Zhuxiang AII Business Group, said biometric technology to diversify, the first generation of optical sensor (optical sensor) module too large for customs inspection, the use of Apple's second-generation push-type capacitor chip (capacitive sensor) price is high, and the fingerprint scan area is too small, easy to have dead or offset.
    
Innolux when exposed to heat induction active NEXT Biometrics fingerprint sensor technology, pleasantly surprised. It scans the fingerprint area, high accuracy, irrespective of the quality of performance do the hard glass or flexible panel of the best, second-generation capacitive fingerprint identification chip compared, the price is quite competitive, serious problem for information security global economy, flexible fingerprint sensor to meet the smart card (smart card) market demand.

Embedded SuperFlash Technology SST Release

The world's leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions supplier --Microchip Technology Inc. (Microchip Technology, Inc.), through its subsidiary, Silicon Storage Technology (SST) announced the launch has been certified based on GLOBALFOUNDRIES 130 nm BCDLite technology platform, SST mask low frequency embedded SuperFlash? non-volatile memory (NVM) technology. Only four easy steps to mask the SST SuperFlash embedded storage solutions and GLOBALFOUNDRIES 'BCDLite technology combine to provide both cost-effective, high durability to supply embedded microcontroller (MCU) and industrial IC designers Flash memory solutions. Such as battery charging (5V-30V) high-capacity power supply applications, GLOBALFOUNDRIES 130 nm BCDLite platform with SST SuperFlash embedded memory function will achieve advanced battery monitoring function, accurate measurement of battery life and health.
As the industry's first combination of SST SuperFlash embedded memory technology and advanced simulation technology foundry, GLOBALFOUNDRIES of 130 nm BCDLite platform with industry-leading Rdson, which allows designers to achieve a small die size programmable single-chip power solution .
SST global marketing and business development director Vipin Tiwari said: "Embedded SuperFlash technology low mask times and advanced process nodes 130 nm BCDLite combination product opens up new potential applications, especially for the power management market, so people are excited. now, there BCDLite technology needs of customers can add SuperFlash embedded memory technology for its complex algorithms while reducing costs. "
Dave Eggleston, vice president of the Embedded Memory GLOBALFOUNDRIES, said: "We work with the customer to develop the SST-ready 130 nm modular BCD + NVM platform, providing customers with an unprecedented level of integration for all kinds of demanding battery powered applications, including unmanned aerial vehicles, intelligent motor control and normally off mobile computing. "
SST SuperFlash technology solutions based on GLOBALFOUNDRIES 130 nm BCDLite platform is now on the market, while providing comprehensive technical support from the rich resources of a custom library, the custom library contains ready-made IP modules for analog resources / power SoC optimized .
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Toshiba, Western Digital plans to hit 14.6 billion US dollars to expand investment in the 3D memory

Toshiba (Toshiba) and US partner Western Digital (WD), proposed a substantial increase in investment in memory in the hope that the expansion force of anti-South Korea joint enemy Samsung.
Western Digital in May after completion of acquisitions SanDisk, SanDisk and Toshiba together to undertake in Yokkaichi, Japan memory joint venture factories. According to the Nikkei news reports, Western Digital and Toshiba plans to invest in the next three years to plant 1.5 trillion yen ($ 14.6 billion), higher than the size of the previous round of investment into three, in addition to the installation of a new machine, will then build a new plant.
Yokkaichi plant this spring, is already in production 3D memory, a new round of investment the main purpose is to increase the 3D memory capacity. 3D memory of the 2017 fiscal year, accounting for five percent the proportion of factory output in 2018 will increase to eighty percent more than forecast.
Samsung is currently the leading NAND memory of last year, the total amount spent on capital investment, Samsung Semiconductor came 14.7 trillion won ($ 12.8 billion), which covers the memory and logic chips, Toshiba and Western Digital reasonable reckoning a new round of three-year investment plan, scale should be comparable with Samsung.
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