ON Semiconductor Introduces Automotive Power Integration Module program

Promote energy efficiency and innovative Semiconductor (ON Semiconductor), further expansion of automotive power integrated module (PIM) product line, launched STK984-190-E. The module is optimized for driving three-phase brushless DC motor (BLDC) for modern automotive applications, comprising six 40 V, 30 A MOSFET configured as a three-phase bridge, and an additional 40 V, 30 A high-side reverse battery protection MOSFET. The MOSFET is mounted onto a direct bond copper (DBC) substrate, resulting in a compact module with excellent heat dissipation, it is only as effective as discrete programs half the board space.
The module is suitable for 12 V automotive motor drive applications, rated power of 300 W, electric pumps, fans and windshield wipers. Using motor controller designers to incorporate such LV8907UW, can create energy efficient BLDC solution with best-in thermal performance and built-in diagnostics, and ultra-small PCB, saving critical dimensions and weight.
Use this module can significantly reduce component count and BOM cost. DBC substrate thermal resistance reduced, thereby reducing the operating temperature of the MOSFET. By reducing the thermal cycling during temperature changes, which reduces the power consumption and increase reliability. Insulation provided by the DBC substrate also enhance the reliability. STK984-190-E specified operating temperature range of -40 ° C to 150 ° C. All integrated MOSFET through AEC-Q101 certification.
Chris Chey, general manager of ON Semiconductor System Solutions Division, said:. "Develop an efficient BLDC drive program usually takes at least 13-15 discrete components, while less than half the number of car components STK984-190-E power modules required in addition to a compact size, STK984-190-E support robust thermal performance with a smaller heat sink. this enables the size and weight of the system is significantly reduced, which means engineers can fully address the challenges currently facing with regard to improve fuel economy and overcoming space constraints. "
STK984-190-E lead-free DIP-S3 package measuring 29.6mm x 18.2mm x 4.3mm.

The world's first flexible thermal sensing fingerprint sensor production

Global electronic payment market to flourish, while derivative transactions security, science and technology in biometric fingerprint identification because most credible, widely used. Panel maker Innolux and Norway NEXT Biometrics ASA jointly announced the world's first co-production flexible thermal sensing fingerprint sensor to become Amway is funding.
    
Innolux and NEXT Biometrics since 2011 jointly developed heat sensors on the glass, 2016 NEXT Biometrics have shipped one million fingerprint sensors to the well-known PC makers for its business notebooks and tablet use.
    
With the global information security problematic, biometrics demand doubled, combined Innolux flexible panel manufacturing capacity and Next Biometrics fingerprint active thermal sensing patents, successfully developed the world's first flexible fingerprint sensor, aimed at the one hundred million per year smart card (smart card), credit card or stored value card Yifu Ka opportunities, NEXT Biometrics estimated 2017 shipments per month 2 million flexible fingerprint sensor 2018 may grow to 10 million per month or more .
    
NEXT Biometrics CEO Tore Etholm-Ids? E said, there are the world's largest smart card (smart card) for our company the flexible fingerprint reader, the initiative to express interest in purchasing. Thanks Innolux R & D team to help solve the problems of thermal sensors to do the flexible panel, met in recent months significant progress in quality, we are proud to announce that Innolux NEXT Biometrics and flexible production fingerprint sensor will come in the near future time, to provide the best solutions in the global transaction security.
    
Optical group deputy general manager Yang Zhuxiang AII Business Group, said biometric technology to diversify, the first generation of optical sensor (optical sensor) module too large for customs inspection, the use of Apple's second-generation push-type capacitor chip (capacitive sensor) price is high, and the fingerprint scan area is too small, easy to have dead or offset.
    
Innolux when exposed to heat induction active NEXT Biometrics fingerprint sensor technology, pleasantly surprised. It scans the fingerprint area, high accuracy, irrespective of the quality of performance do the hard glass or flexible panel of the best, second-generation capacitive fingerprint identification chip compared, the price is quite competitive, serious problem for information security global economy, flexible fingerprint sensor to meet the smart card (smart card) market demand.

Embedded SuperFlash Technology SST Release

The world's leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions supplier --Microchip Technology Inc. (Microchip Technology, Inc.), through its subsidiary, Silicon Storage Technology (SST) announced the launch has been certified based on GLOBALFOUNDRIES 130 nm BCDLite technology platform, SST mask low frequency embedded SuperFlash? non-volatile memory (NVM) technology. Only four easy steps to mask the SST SuperFlash embedded storage solutions and GLOBALFOUNDRIES 'BCDLite technology combine to provide both cost-effective, high durability to supply embedded microcontroller (MCU) and industrial IC designers Flash memory solutions. Such as battery charging (5V-30V) high-capacity power supply applications, GLOBALFOUNDRIES 130 nm BCDLite platform with SST SuperFlash embedded memory function will achieve advanced battery monitoring function, accurate measurement of battery life and health.
As the industry's first combination of SST SuperFlash embedded memory technology and advanced simulation technology foundry, GLOBALFOUNDRIES of 130 nm BCDLite platform with industry-leading Rdson, which allows designers to achieve a small die size programmable single-chip power solution .
SST global marketing and business development director Vipin Tiwari said: "Embedded SuperFlash technology low mask times and advanced process nodes 130 nm BCDLite combination product opens up new potential applications, especially for the power management market, so people are excited. now, there BCDLite technology needs of customers can add SuperFlash embedded memory technology for its complex algorithms while reducing costs. "
Dave Eggleston, vice president of the Embedded Memory GLOBALFOUNDRIES, said: "We work with the customer to develop the SST-ready 130 nm modular BCD + NVM platform, providing customers with an unprecedented level of integration for all kinds of demanding battery powered applications, including unmanned aerial vehicles, intelligent motor control and normally off mobile computing. "
SST SuperFlash technology solutions based on GLOBALFOUNDRIES 130 nm BCDLite platform is now on the market, while providing comprehensive technical support from the rich resources of a custom library, the custom library contains ready-made IP modules for analog resources / power SoC optimized .
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Toshiba, Western Digital plans to hit 14.6 billion US dollars to expand investment in the 3D memory

Toshiba (Toshiba) and US partner Western Digital (WD), proposed a substantial increase in investment in memory in the hope that the expansion force of anti-South Korea joint enemy Samsung.
Western Digital in May after completion of acquisitions SanDisk, SanDisk and Toshiba together to undertake in Yokkaichi, Japan memory joint venture factories. According to the Nikkei news reports, Western Digital and Toshiba plans to invest in the next three years to plant 1.5 trillion yen ($ 14.6 billion), higher than the size of the previous round of investment into three, in addition to the installation of a new machine, will then build a new plant.
Yokkaichi plant this spring, is already in production 3D memory, a new round of investment the main purpose is to increase the 3D memory capacity. 3D memory of the 2017 fiscal year, accounting for five percent the proportion of factory output in 2018 will increase to eighty percent more than forecast.
Samsung is currently the leading NAND memory of last year, the total amount spent on capital investment, Samsung Semiconductor came 14.7 trillion won ($ 12.8 billion), which covers the memory and logic chips, Toshiba and Western Digital reasonable reckoning a new round of three-year investment plan, scale should be comparable with Samsung.
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Foxconn transformation or a tremendous impact on the mobile phone industry

Recently, Foxconn announced financial technology and services platform will be launched during the year in the rich rich, it is understood that the financial services for the electronics supply chain, not pre-oriented consumers. Foxconn has made loans, financial guarantees operating license qualifications and equipment leasing and factoring and other local services. The wallet management platform in addition to the supply chain partners, will also step into the P2P net loan field. In addition, Foxconn future will establish a private equity fund of 300 million yuan, the main investment in the mainland of start-up companies.
As Apple's largest contract manufacturer, Foxconn has set up at least six financial services companies in the Chinese mainland, and to provide 10 billion yuan of funds to the periphery more than 100 component suppliers.
Media that Foxconn main purpose is to reduce dependence on Apple and get involved in high-margin business areas, at present, about 50% of Foxconn's revenue from Apple, but it may not stop there.
If you do not read Foxconn purpose and future development of financial products available, let us recall that in the previous two months, Foxconn done.
In early April this year, Foxconn to 3,890 billion yen ($ 3.5 billion) acquisition of a majority stake in Japan's Sharp. Media said Terry Gou, Foxconn hopes to embark on the road of transformation, has become an international brand-name manufacturers.
The end of May, Foxconn with the transaction price of 350 million US dollars from the hands of Microsoft bought Nokia's functional machine business.
After reviewing these two news, Foxconn is not that more mysterious ...... so let us look at Foxconn depth this series of moves, what specifically do something.
It is understood that Foxconn has made propaganda in China Taiwan region to promote team while promoting InFocus phone Nokia and Sharp's mobile phone business, Nokia and Sharp to enter China Taiwan market. In the future, Sharp will only Foxconn mobile positioning high-end products, while the InFocus as low-end products. Nokia is a functional machine product line.
In the Japanese market, Sharp Foxconn before getting smart phone business has been promoting InFocus mobile phone brands, and after obtaining Sharp smartphones, given the Sharp has a higher profile in Japan, so the focus will be the promotion of Foxconn put Japan Sharp body.
So, Foxconn layout of the mobile phone industry to get involved in the financial industry and what is the relationship?
Foxconn financial services executives believe that "Foxconn supply chain has a natural advantage, we understand better than anyone the electronic component supplier's business situation, because they are our customers." Obviously, Foxconn is helping companies solve supply chain their financial problems should be noted that, although the pre Foxconn to do just to help enterprises solve financial problems, but the official also said that if this business progress, will launch a direct-to-consumer financial products. In short, supply chain finance Foxconn to start, and then goes directly to ordinary investors sold financial products packaged loans.
Although we can not predict how Foxconn which actions carried out in the consumer finance market, but what is certain is that after the phone has a complete product line to provide consumers with online financial services such as money market funds, consumer persons and micro-credit loans allow Foxconn to reach the fastest speed in transition.
Let us imagine that. Future, have a Sharp (high-end), InFocus (low-end), Nokia (low-end functional machine) three brands of enterprises to purchase installments 0 Interest way to provide consumers with similar microcredit finance products, while providing other financial services, and he is the mobile phone industry's largest OEM manufacturers, he is Foxconn after the transition, he would cause much of an impact the industry?
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The semiconductor industry M & A wave fundamental reason Secret

Expand market share, networking opportunities, increased research and development costs, China's ambitions for the semiconductor industry, all of which contributed to the recent mergers and acquisitions wave.
Not difficult to find, the recent surge in M ​​& A activity, including the Chinese consortium "aggressive" in the new program aims to strengthen its voice in the semiconductor industry.
Except that "fanaticism", "crazy" this word is really hard to describe 2015, the semiconductor industry's huge wave of mergers and acquisitions. In the first half of 2015 a short time, it has announced the acquisition of a semiconductor involving an amount of up to $ 72.06 billion (as shown in Figure 1), which over the past five years (2010-2014) the average deal nearly six times.

2010-2015 involving an amount of mergers and acquisitions in the first half of the semiconductor
Three acquisitions in the first half of 2015 has been the 2015 merger record history. First, NXP announced in March to $ 11.08 billion in cash and stock acquisition of Freescale; in late May, Avago announced a $ 37 billion acquisition of Broadcom; only four days later (June 1), Intel said it has reached an agreement to $ 16.7 billion cash acquisition of Altera Corporation. Avago surprisingly acquisition Broadcom IC industry and so far largest acquisition.
Throwing money to take the money
In many ways, 2015 has become a perfect storm in the joint between acquisitions, mergers, major suppliers, IC manufacturers saw sales slow down its existing market segments, need to expand their business in order to keep investors. Rising costs of product development and research of advanced technology, but also need to encourage manufacturers to make larger scale and in the next five years, a higher sales rate. Things huge market potential, but also led to a major supplier of integrated circuits readjust their strategy, and quickly fill part of their portfolio missing. China's ambitious goal, namely to reduce the imports of IC devices, and even self-sufficient, which also contributed to a number of Chinese companies and investment group acquisitions.
IC industry to mature
IC Insights analysts believe that an increasing number of mergers and acquisitions will lead to major chip manufacturers and suppliers less and less, which is a major change in the supply chain, indicating the maturity of the industry. In addition to the wave of mergers and acquisitions taking place, such as lack of start any new entry point for IC manufacturers, the strong momentum into the fab-lite business model, as well as capital expenditure as a percentage of sales ratio decline trend, are harbingers of the next five years, the semiconductor industry will remodeling.
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Apple set up a subsidiary to sell surplus energy solar power

According to foreign media reports a number of technology, Apple has just founded a subsidiary of energy "Apple Energy LCC", which is registered in Delaware, but the company is located in the Apple Cupertino headquarters.
The company's assets include Nevada and California power facilities, including for providing power to the headquarters of spacecraft solar panels and fuel cells.
Apple to the US Federal Energy Regulatory Commission indicated that it should be consistent with the market price, rather than the wholesale price of electricity sales standards, because there is no significant impact on the energy industry, will not affect the market price. Apple approved the request after filing the application to start selling electricity (June 6) in 60 days.
Many states implement net metering (Net Metering), the grid allows users to have green energy generation facilities to the grid transmission of electricity, the excess power to sell a profit. Because of the large scale power generation projects Apple and quite complicated, Apple needs to set up a subsidiary to sell surplus electricity.
Apple is unlikely to sell electricity to consumers, because it requires the establishment of costly new infrastructure, transmission of electricity to the home, but also face other obstacles. Instead, the excess power during the day and sold to local power companies to help offset the evenings and rainy days is insufficient solar power grid electricity costs.
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